Sputtering Container Asymmetric Fixing and Titanium Material
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Solution Overview
Problem
Sputtering apparatuses cause contamination and damage to containers due to target material adherence and high-temperature plasma-induced expansion, leading to frequent replacement and handling issues.
Innovation Solution
A sputtering apparatus design with differently sized and threaded container fixing holes allows for varying attachment tightness, and the use of a damage-resistant material like titanium for the container, enabling expansion without damage and reducing contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the container is tightly fixed to the plate, then the container is stable and secure, but the container is damaged due to thermal expansion from high-temperature plasma
Solution Approach 1:
The fixing holes are designed with asymmetric threading: one side has a threaded hole that allows tight fixing, while the other side has a non-threaded hole that allows loose fixing. This dynamic configuration enables the container to be securely held while accommodating thermal expansion movements, resolving the contradiction between stability and integrity.
Solution Approach 2:
Different local qualities are applied to different sides of the container through asymmetric fixing hole design. One side provides strong mechanical attachment (threaded hole) for stability, while the other side provides flexible attachment (non-threaded hole) for expansion accommodation, allowing each side to serve its specific function.
2Stability of the object's composition
If the container is made of quartz or pyrex, then the container can maintain uniform temperature, but the container is susceptible to damage from outside pressures and thermal expansion
Solution Approach 1:
The material parameter is changed from traditional quartz/pyrex to titanium. Titanium maintains the required thermal properties for uniform temperature distribution while providing superior mechanical strength and pressure resistance, eliminating the vulnerability to damage while preserving temperature stability.
3Manufacturing precision
If the container is replaced frequently to prevent contamination, then the substrate is protected from impurities, but the handling process increases damage risk and reduces productivity
Solution Approach 1:
The asymmetric fixing hole design is implemented as a preliminary preventive measure to accommodate thermal expansion before damage occurs. This prevents container damage and contamination in advance, eliminating the need for frequent replacements and maintaining high productivity while ensuring substrate purity.
Solution Approach 2:
The thermal expansion, which was previously a harmful cause of container damage, is converted into a beneficial feature by providing expansion space through the non-threaded fixing hole. This allows the container to expand freely during plasma generation without damage, preventing contamination and reducing replacement frequency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design prevents container damage and contamination by allowing thermal expansion and using titanium for enhanced durability and heat conductivity, improving manufacturing yields and reducing handling risks.
Implementation Method 1
the container is easily damaged from heat expansion
Implementation Method 2
using titanium for enhanced durability and heat conductivity
Implementation Method 3
plasma is generated by applying a high voltage
Implementation Method 4
ionic Ar+ ions collide with the target 115, and particles separated from the target 115 are deposited on the substrate 107
Data Source
AI summary
A sputtering apparatus includes a container; a plate for supporting the container; a first attachment for attaching the container to the plate; and a second attachment for less tightly attaching the container to the plate than through the first attachment.


