Sputtering Apparatus with Dual-Axis Substrate Rotation
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Solution Overview
Problem
Existing sputtering methods struggle to maintain consistent magnetic anisotropy in soft magnetic layers due to changing particle impingement directions during substrate rotation, and analysis chambers require excessive space for precise positioning.
Innovation Solution
A sputtering apparatus with a substrate holder featuring a first and second rotating stage, a spinning unit, and a revolving unit, along with a magnetic field applying unit, maintains the substrate's direction constant relative to the target, and a compact analysis apparatus with a substrate holder and beam source for precise film characterization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If substrate rotation is performed during sputtering to improve thickness uniformity, then film thickness uniformity is improved, but the direction of particle impingement on substrate changes incessantly making it difficult to obtain high magnetic anisotropy
Solution Approach 1:
The patent applies dynamics by implementing a dual-rotation system where the substrate rotates on its own axis while simultaneously revolving around the target. This dynamic configuration allows the substrate to maintain a constant orientation relative to the target during sputtering, ensuring consistent particle impingement direction for high magnetic anisotropy while still achieving uniform film thickness through the combined rotational motion.
Solution Approach 2:
The patent introduces an additional dimensional aspect by adding the revolution motion around the target to the conventional substrate rotation. This transforms the single-axis rotation into a two-dimensional motion pattern, where the substrate both spins on its axis and orbits the target, thereby maintaining constant orientation while achieving uniform deposition.
2Measurement precision
If a large stage with width and length at least twice those of the substrate is used to position the entire substrate surface at the beam irradiation position, then analysis precision is improved, but the analysis chamber size becomes large
Solution Approach 1:
The patent applies dynamics by replacing the static large stage with a dynamic positioning system using dual rotation. The substrate rotates on its axis while revolving around the beam source, allowing any point on the substrate surface to be brought to the irradiation position sequentially. This dynamic approach enables complete substrate analysis with a much smaller chamber size.
Solution Approach 2:
The patent introduces revolutionary motion around the beam source as an additional dimension to the conventional x-y stage positioning. This transforms the two-dimensional stage movement into a three-dimensional positioning system, where the substrate can be oriented and positioned from multiple spatial perspectives, enabling complete surface analysis without requiring a large chamber.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the formation of thin films with high magnetic anisotropy and reduces the size of analysis chambers, improving both magnetic film quality and analysis precision while minimizing space requirements.
Implementation Method 1
a target which can deposit a film on the substrate by sputtering
Implementation Method 2
a magnetic field applying unit which can apply a magnetic field in a specific direction to the substrate
Data Source
AI summary
A sputtering apparatus includes a substrate holder, a magnetic field applying unit, and target mounting table. The substrate holder includes a first stage which can mount a substrate and can rotate about a first rotating shaft, a second stage which can rotate about a second rotating shaft shifted from the first rotating shaft, a spinning unit which rotates the first stage about the first rotating shaft, and a revolving unit which revolves the first stage about the second rotating shaft. The magnetic field applying unit applies a magnetic field in a specific direction to the substrate. The target mounting table can mount a target configured to deposit a film on the substrate. The spinning unit rotates the first stage in a direction opposite to that of the rotation of the revolving unit, and rotates the first stage so as to maintain the specific direction of the magnetic field.