Sputtering Apparatus with Dual-Sided Cylindrical Targets
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current sputtering apparatuses face challenges in efficiently mounting and controlling sputtering targets within sputtering chambers, particularly in terms of speed, cost, and operator ease, especially when coating substrates on both sides simultaneously.
Innovation Solution
The apparatus features a sputtering chamber with at least two cylindrical magnetron targets mounted on opposite sides of a substrate conveyor, allowing for independent operation of each target and the use of a mobile shielding apparatus to protect inactive targets from sputtered material, with a lid-mounted configuration for easy maintenance and gas distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple sputtering targets are mounted on opposite sides of the substrate conveyor for dual-sided coating, then productivity is improved by coating both sides simultaneously, but device complexity increases due to the need for multiple targets and mounting mechanisms
Solution Approach 1:
The sputtering targets are divided into modular cylindrical magnetron units that can be independently mounted on opposite sides of the substrate conveyor. Each target is a self-contained module with its own mounting mechanism, allowing independent installation, operation, and maintenance on either side of the conveyor system.
Solution Approach 2:
The mounting arrangement uses universal flange connections and standardized mounting interfaces that can accommodate different target configurations. The same mounting mechanism can hold targets in various positions (above or below the conveyor) and can be adapted to different target sizes and types, reducing the need for specialized components.
2Ease of repair
If sputtering targets are mounted to a removable lid rather than the chamber body, then ease of repair is improved by allowing integral removal of targets for maintenance, but device complexity increases due to the lid assembly design
Solution Approach 1:
The sputtering targets are integrated with the lid structure as a single removable assembly. The targets are mounted to the lid in such a way that they move together as one unit, allowing all targets to be removed and installed by simply detaching and attaching the lid, eliminating the need for complex individual target mounting mechanisms.
Solution Approach 2:
The targets are pre-assembled on the lid outside the chamber before the lid is installed. This preliminary assembly allows for easier target installation and replacement without requiring disassembly of the chamber body or complex in-chamber manipulation mechanisms.
3Manufacturing precision
If a mobile shielding apparatus is used to protect inactive targets from sputtered material, then manufacturing precision is improved by preventing contamination, but device complexity increases due to the shielding mechanism
Solution Approach 1:
The shielding apparatus is designed as a mobile structure that can move between an extended position (when targets are inactive) and a retracted position (when targets are active). This dynamic positioning allows the shields to protect inactive targets from sputtered material while not interfering with the operation of active targets, achieving contamination prevention without permanent structural complexity.
4Productivity
If cylindrical magnetron targets are used instead of planar targets, then productivity is improved by enabling rotation for uniform coating, but device complexity increases due to the rotational mechanism
Solution Approach 1:
The cylindrical magnetron targets are designed to rotate under their own weight when positioned vertically, utilizing gravity as the driving force. This self-rotating mechanism eliminates the need for external motors or complex drive systems, achieving uniform coating distribution through the natural rotation of the cylindrical targets as substrates pass by.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient, cost-effective, and user-friendly dual-sided coating of substrates by allowing independent target operation and protection from sputtered material, enhancing operational efficiency and reducing maintenance complexity.
Implementation Method 1
The substrates are coated via physical vapor deposition, which utilizes a plasma energy source, the position and density of which is controlled by a magnetic field
Implementation Method 2
The substrates are coated via physical vapor deposition
Implementation Method 3
The deposition is brought about by bombardment of the target surface by ions, which are formed in a gaseous plasma and energized via a voltage applied by the electrode to the target
Data Source
AI summary
A sputtering chamber includes at least two sputtering targets, one of the at least two targets disposed on a first side a substrate conveyor extending within the chamber, and another of the at least two targets disposed on a second side of the conveyor. The at least two targets may be independently operable, and at least one of the targets, if inactivated, may be protected by a shielding apparatus. Both of the at least two targets may be mounted to a first wall of a plurality of walls enclosing the sputtering chamber.