Sputtering Device Dynamic Rotation for Film Uniformity
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Solution Overview
Problem
Conventional oblique incidence sputtering technologies face challenges in maintaining uniformity of film thickness and sheet resistance distribution, especially when high electric discharge power is used, leading to increased deviations in magnetic film formation.
Innovation Solution
A sputtering device and method that incorporates a substrate holder with a magnetic field forming device and a control system to adjust the substrate's rotation speed based on its position relative to the cathodes, creating regions with varying magnetic fields to control sputtering particle attraction, thereby maintaining uniform film thickness and sheet resistance distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high electric discharge power is supplied to increase sputtering rate, then productivity is improved, but manufacturing precision deteriorates due to increased sheet resistance deviation
Solution Approach 1:
The substrate rotation speed is dynamically adjusted based on the rotation position rather than maintaining a constant speed. The control device increases rotation speed when the first portion (high attraction region) approaches the cathode and decreases speed when the second portion (low attraction region) approaches, creating a dynamic compensation mechanism that maintains uniformity despite high power sputtering
Solution Approach 2:
A position detecting device detects the rotation position of the substrate in real-time, and this information is fed back to the control device which adjusts the rotation speed accordingly. This closed-loop feedback system enables precise control of the substrate rotation to compensate for magnetic field distribution variations
2Ease of manufacture
If oblique incidence sputtering is used to form magnetic film, then film formation is achieved, but manufacturing precision deteriorates due to large sheet resistance deviation
Solution Approach 1:
The substrate is divided into regions with different magnetic attraction characteristics (first portion with high attraction and second portion with low attraction). The control device applies different rotation speeds to different portions based on their position, creating locally optimized deposition conditions for each region to achieve overall uniformity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the formation of magnetic films with excellent uniformity in film thickness and sheet resistance distribution, even when using high electric discharge power, by dynamically controlling the substrate's rotation speed in response to its position within the magnetic field.
Implementation Method 1
a substrate magnetic field forming device disposed around the substrate and rotatable together with or in synchronization with the substrate to form a magnetic field on the processing surface of the substrate
Implementation Method 2
cathodes disposed at positions to face obliquely the substrate and supplied with electric discharge power
Implementation Method 3
supplying cathodes with high electric discharge power to cause electric discharge between the cathodes and a substrate holder, thereby sputtering targets mounted on the cathodes
Data Source
AI summary
A magnetic film having excellent uniformity in in-plane distribution of film thickness or sheet resistance is formed when the film is formed by forming a magnetic field on a processing surface of a substrate (21) and performing oblique incidence sputtering by using high discharge power.A sputtering apparatus (1) is provided with a substrate holder (22) for holding rotatably the substrate (21) in the surface direction of the processing surface of the substrate; a substrate magnetic field forming device (30) which is disposed to surround the substrate (21) and forms a magnetic field on the processing surface of the substrate (21); cathodes (41) which are arranged diagonally above the substrate (21) and are supplied with electric discharge power; a position detecting device (23) for detecting a rotation position of the substrate (21); and a control device (50) which adjusts the rotation speed of the substrate (21) in accordance with the rotation position detected by the position detecting device (23).