Sputtering Fine Pattern Formation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing pattern formation methods, such as photolithography and laser processing, are costly and require complex equipment, limiting the efficiency and cost-effectiveness of forming fine patterns in industrial applications like LED and bio devices.
Innovation Solution
A method using sputtering to form fine patterns by controlling power, bias, and temperature conditions, eliminating the need for multi-step photolithography and expensive laser processing, allowing for the creation of nano-sized or micro-sized patterns on substrates like silicon, glass, and ceramics at a lower cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithography is used to form patterns, then pattern formation capability is achieved, but process complexity and equipment cost increase significantly
Solution Approach 1:
The invention extracts and eliminates the photolithography process entirely from the pattern formation sequence. By using direct sputtering with controlled parameters (power density 0.11-0.76 W/cm², substrate temperature 50-200°C, Ar gas flow 10-50 sccm), the method achieves fine pattern formation without requiring photoresist coating, masking, development, and etching steps, thus removing the complex photolithography subsystem while retaining pattern formation capability
Solution Approach 2:
The invention replaces the optical-mechanical photolithography system with a direct physical vapor deposition (sputtering) system. Instead of using light exposure through masks to define patterns, the method uses controlled sputtering parameters to directly deposit material in desired patterns, substituting a simpler mechanical/physical process for the complex optical process
2Manufacturing precision
If photolithography is used to form patterns, then pattern formation capability is achieved, but equipment cost and processing cost increase
Solution Approach 1:
The invention replaces expensive photolithography equipment (photolithography machines, clean room facilities, mask making equipment) with a relatively simple sputtering system. The sputtering process uses inexpensive consumables (Ar gas, standard sputtering targets) and can be performed in standard vacuum chambers, dramatically reducing equipment investment while maintaining pattern formation capability through controlled deposition parameters
3Manufacturing precision
If laser processing is used to form patterns, then fine pattern formation is achieved, but equipment cost increases significantly
Solution Approach 1:
The invention replaces the expensive laser processing system with a sputtering-based physical vapor deposition system. Instead of using high-power lasers to ablate or modify material surfaces, the method uses controlled sputtering to deposit material in fine patterns, substituting a costly optical system with a more economical physical deposition process that achieves comparable or superior fine pattern resolution
4Manufacturing precision
If multiple photolithography steps are used to form fine patterns, then pattern precision is improved, but processing time and productivity decrease
Solution Approach 1:
The invention merges multiple photolithography steps (photoresist coating, pre-bake, mask alignment, exposure, development, post-bake, etching, rinse, dry) into a single sputtering process. By controlling sputtering parameters (power density, substrate temperature, gas flow, deposition time), the method achieves fine pattern formation in one continuous deposition step, eliminating the need for multiple sequential processing steps and significantly reducing total processing time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the simple and cost-effective formation of fine patterns with adjustable size and interval, offering superior productivity and economic benefits, and can produce atypical patterns with enhanced water repellency suitable for electronic and bio devices.
Implementation Method 1
a method of forming a fine pattern using sputtering
Data Source
Figure 1
Figure 2~3
Figure 4
AI summary
This invention relates to a method of forming a fine pattern, and more particularly, to a method of forming a fine pattern using only sputtering, which enables the fine pattern to be simply formed at low cost, thus exhibiting superior productivity and economic benefits.