Sputtering Device Mask Transfer for Multi-Material Film Deposition
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Solution Overview
Problem
Existing sputtering devices face inefficiencies and increased costs due to the need to remove substrates and change masks when forming films of different materials, which can expose easily oxidizable alloys to the atmosphere and require additional space and equipment.
Innovation Solution
A sputtering device with a hermetically sealed vacuum chamber, multiple fixed targets, a substrate holding unit, and transfer units that allow the substrate and mask to be moved within the chamber, eliminating the need to remove the substrate or change masks, and enabling the formation of films with different patterns using various alloy materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the substrate is taken out of the sputtering device to change masks, then films of different materials can be formed on different regions, but the operation efficiency deteriorates and the substrate may be exposed to the atmosphere causing film characteristic changes
Solution Approach 1:
The mask is made movable relative to the substrate through a transfer mechanism, allowing the mask pattern to be dynamically repositioned without removing the substrate. This enables different through-hole patterns to be aligned with different targets while the substrate remains in the vacuum chamber, thus maintaining both versatility and productivity
Solution Approach 2:
A single mask with multiple through-hole patterns is designed to serve multiple functions by being repositioned to different locations. The same mask can create different film patterns on the substrate by being transferred to different positions, eliminating the need for multiple separate masks and maintaining operational efficiency
2Adaptability or versatility
If the substrate is taken out of the sputtering device to change masks, then films of different materials can be formed on different regions, but the device complexity increases due to separate vacuum chambers or adjacent sputtering devices
Solution Approach 1:
The mask transfer mechanism is integrated within the single vacuum chamber, combining the mask changing function with the existing sputtering apparatus. This eliminates the need for separate vacuum chambers or adjacent sputtering devices, reducing overall device complexity and space requirements while maintaining the ability to form different film patterns
3Adaptability or versatility
If the substrate is taken out of the sputtering device to change masks, then films of different materials can be formed on different regions, but the time required for mask placement increases
Solution Approach 1:
Multiple through-hole patterns are pre-formed on a single mask at different locations. Before sputtering begins, the mask is positioned with the appropriate through-hole pattern aligned with the corresponding target. This preliminary arrangement of all possible patterns on one mask eliminates the time required for substrate removal and sequential mask changes during the sputtering process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances operational efficiency, prevents exposure of films to the atmosphere, reduces space and cost requirements, and allows for the formation of films with different patterns and materials within the same device, improving the quality and versatility of film deposition.
Implementation Method 1
An inert gas (Ar gas) is introduced into a vacuum created in the sputtering device, and a target comprising an alloy material is heated by plasma discharge. The target is bombarded by ionized Ar, and fine particles of the alloy material are ejected from the target and form a film on the substrate.
Implementation Method 2
a vacuum chamber that is evacuated and hermetically sealed
Data Source
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AI summary
A sputtering device 1 includes: a vacuum chamber 2; a plurality of targets 8 (8a to 8d); a shield 9 that selectively exposes, to the inside of the vacuum chamber 2, only a target 8c out of which a film is to be formed; a substrate holding unit 11 that holds a substrate 10 on which fine particles ejected from the target 8c are deposited to form a film; a first transfer unit 14 that fixedly holds and moves the substrate holding unit 11; a mask 16 disposed between the substrate 10 and the target 8c; a second transfer unit 19 that moves the mask 16; and a plurality of through-hole units 17a to 17f having patterned through holes 17 penetrating through the mask 16.