Sputtering Chamber Plasma Cleaning for Redeposition Removal

The patent replaces mechanical cleaning methods (which require opening the chamber) with a plasma-based chemical cleaning system. The plasma generation unit creates reactive plasma species that chemically react with and remove redeposited materials without requiring physical access to the chamber interior, thus maintaining process continuity while achieving effective cleaning.

The patent introduces plasma as an intermediary substance to facilitate the cleaning process. The plasma generation unit produces plasma that acts as a mediator between the cleaning requirement and the redeposited materials, enabling removal of contaminants through chemical reactions rather than direct mechanical intervention, thereby avoiding chamber opening and process interruption.

The patent implements periodic RF power application with varying intensity levels. The control unit adjusts the RF power in multiple stages: initial high power to break down heavy redeposited materials, followed by reduced power for maintenance cleaning. This periodic variation in power intensity achieves effective cleaning while minimizing overall energy consumption compared to continuous high-power operation.

The patent dynamically changes RF power parameters (intensity, duration, frequency) based on the cleaning stage and chamber conditions. The control unit monitors cleaning progress and adjusts power levels accordingly, transitioning from high-power aggressive cleaning to low-power maintenance mode, thereby optimizing the balance between cleaning effectiveness and energy consumption.