Sputtering Apparatus Shield Member for Pressure Gauge Protection
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Solution Overview
Problem
In sputtering processes, pressure gauges are prone to contamination due to sputtered films, leading to particle contamination of substrates and reduced measurement accuracy, especially with diaphragm vacuum gauges, which are sensitive to contamination and require accurate pressure measurement during film formation.
Innovation Solution
A sputtering apparatus with a concave portion and a shield member that is buried within it to shield the opening portion, reducing particle contamination and film formation on both the substrate and pressure gauge, while allowing accurate pressure measurement by positioning the pressure gauge near the substrate stage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a pressure gauge is exposed to the sputtering space to measure pressure during deposition, then accurate pressure measurement is achieved, but the pressure gauge becomes contaminated by sputtered films and particles
Solution Approach 1:
The pressure gauge is separated from the sputtering space by introducing a vacuum conduit that extends from the sputtering space through a partition wall to the pressure gauge located in a separate gauge chamber. This segmentation allows the pressure gauge to measure pressure during deposition without being exposed to sputtered films and particles, resolving the contradiction between measurement accuracy and contamination prevention
Solution Approach 2:
A vacuum conduit acts as an intermediary channel connecting the sputtering space to the pressure gauge through a partition wall. This intermediary structure enables pressure transmission while physically isolating the pressure gauge from the contaminated sputtering environment, allowing accurate measurement without direct exposure
2Object-affected harmful factors
If a shutter is used to shield the pressure gauge from the sputtering space, then film formation on the pressure gauge is reduced, but particles are generated from the shutter that contaminate the thin film on the substrate
Solution Approach 1:
The pressure gauge is extracted from the sputtering space and relocated to a separate gauge chamber, eliminating the need for a shutter mechanism. This extraction removes the source of particle contamination while still allowing pressure measurement through the vacuum conduit that passes through the partition wall
Solution Approach 2:
The vacuum conduit serves as an intermediary that transmits pressure information from the sputtering space to the pressure gauge without requiring a shutter. This eliminates the shutter-related particle contamination problem while maintaining the ability to monitor pressure during deposition
3Measurement precision
If the pressure gauge is positioned close to the substrate stage for accurate measurement, then pressure measurement accuracy is improved, but the pressure gauge is more exposed to sputtered films and particles
Solution Approach 1:
The pressure gauge is segmented from the main sputtering space and placed in a separate gauge chamber that is isolated from sputtered films and particles. The vacuum conduit maintains pressure measurement capability while the partition wall provides physical protection, allowing the pressure gauge to be effectively positioned for accurate measurement without increased exposure risk
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces particle contamination on substrates and pressure gauges, maintaining measurement accuracy and ensuring stable process reproducibility by minimizing film thickness and particle generation, particularly beneficial for sensitive diaphragm vacuum gauges.
Implementation Method 1
a shield member configured to shield a linear path between the space and the opening portion
Implementation Method 2
a pressure gauge which can measure the pressure in the sputtering space is attachable
Implementation Method 3
a sputtering apparatus capable of reducing particle contamination of a film formed on a substrate
Data Source
AI summary
A sputtering apparatus includes a space defining member defining a sputtering space for forming a film on a substrate. The space defining member includes a concave portion, and an opening portion is provided in the bottom portion of the concave portion. The sputtering apparatus includes a shield member configured to shield the opening portion from the sputtering space. The opening portion is formed so that a pressure gauge capable of measuring the pressure in the sputtering space can be attached, and the shield member is arranged so that at least a part of the shield member is buried in the concave portion.