Multi-Target Sputtering Shield Plate for Independent Thickness Control
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Solution Overview
Problem
In sputtering apparatuses with multiple targets, adjusting the shape of the through-hole in a sputter particle shielding plate to control film thickness distribution is challenging, as it affects the distribution from all targets, making independent control difficult.
Innovation Solution
A sputtering apparatus with a shielding plate having distinct opening regions for sputter particles from each target and an obstructing mechanism to prevent particles from one target from passing through the other's opening region, allowing independent adjustment of film thickness distribution by adjusting the shape of these regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the shape of the through-hole in the shielding plate is changed to adjust film thickness distribution, then the film thickness distribution can be controlled, but the control affects all targets and independent adjustment becomes difficult
Solution Approach 1:
The through-hole is divided into multiple opening regions, with each region corresponding to a specific target. This segmentation allows sputter particles from different targets to pass through different regions, enabling independent control of film thickness distribution for each target by adjusting the shape of individual opening regions without affecting other targets.
2Productivity
If multiple targets emit sputter particles simultaneously, then productivity is improved, but interference between targets makes precise thickness control difficult
Solution Approach 1:
The shielding plate's through-hole is segmented into multiple opening regions, each dedicated to a specific target. This spatial segmentation allows multiple targets to operate simultaneously while preventing their sputter particles from interfering with each other's deposition patterns, thus maintaining both high productivity and precise thickness control.
Solution Approach 2:
Each opening region is designed with specific local characteristics (shape, size, position) optimized for its corresponding target. This local quality approach ensures that each target's sputter particles are directed precisely where needed, enabling independent optimization of film thickness distribution for each target while maintaining simultaneous operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise and independent control of film thickness distribution from each target, preventing interference between targets and improving film formation accuracy.
Implementation Method 1
a sputtering apparatus for forming a film by allowing sputter particles emitted from a target to be incident on a substrate such as a wafer or the like
Data Source
AI summary
An example of a sputtering apparatus comprises a first target and a second target that emit sputter particles, a substrate support configured to support a substrate, a shielding plate disposed between the first and the second target and the substrate and having a through-hole through which the sputter particles pass, and an obstructing mechanism. The through-hole has a first opening region through which the sputter particles emitted from the fit target pass and a second opening region through which the sputter particles emitted from the second target pass, and the obstructing mechanism is configured to obstruct the sputter particles emitted from the first target in passing through the second opening region and the sputter particles emitted in the second target from passing through the first opening region.