Magnetron Sputtering Shield Layout for Uniform Target Erosion
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Solution Overview
Problem
The sputtering target in magnetron-sputtering methods experiences non-uniform erosion due to uneven magnetic field distribution, leading to inefficiencies in thin film deposition.
Innovation Solution
A sputtering apparatus is designed with a magnet module that reciprocates and includes a first shielding member to reduce magnetic field strength and a second shielding member with a fixed position between the back plate and magnet module, which helps in uniformizing the magnetic field and reducing target erosion non-uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a magnet module is used to generate magnetic field for magnetron sputtering, then deposition rate is increased, but magnetic field distribution becomes uneven causing non-uniform target erosion
Solution Approach 1:
The patent introduces shielding members with specific magnetic permeability at different locations between the magnet module and back plate. These shielding members create locally varied magnetic field distributions, concentrating the field in certain regions and reducing it in others, thereby achieving uniform plasma density and target erosion across the sputtering target surface while maintaining high deposition rate
Solution Approach 2:
The shielding members act as intermediary elements between the magnet module and the sputtering target. By positioning these members with appropriate magnetic permeability in the magnetic field path, they mediate and redistribute the magnetic flux density, transforming the originally non-uniform magnetic field into a more uniform distribution that prevents localized target erosion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the uniformity of the magnetic field and extends the lifetime of the sputtering target by reducing non-uniform erosion, enhancing the deposition process for thin films in display devices.
Implementation Method 1
the magnetic field generated by a magnet module disposed adjacent to a sputtering target captures electrons to generate high-density plasma
Implementation Method 2
shielding members having a fixed position between the back plate and the magnet module... uniformizing the magnetic field
Implementation Method 3
Sputtering is a main method of depositing a metal thin film on a substrate... a magnetron-sputtering method using a magnetic field is used to increase a deposition rate
Data Source
AI summary
A sputtering apparatus includes a back plate supporting a sputtering target, a magnet module disposed under the back plate and including a magnet unit reciprocating in a first direction, a first shielding member attached on a portion of the magnet unit, moving together with the magnet unit, and covering at least a portion of the magnet unit, a protective sheet disposed between the back plate and the magnet module, and a second shielding member disposed between the back plate and the magnet module, and having a fixed position.