Sputtering Apparatus Shielding Structure for Particle Contamination Control
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Solution Overview
Problem
Existing sputtering methods fail to prevent sputtered particles from adhering to the substrate placing surface during conditioning and target cleaning, leading to contamination of the substrate and subsequent manufacturing apparatuses, despite advancements in electronic device performance requiring atomic-level film adhesion prevention.
Innovation Solution
A sputtering apparatus with a first shield member and a second shield member, featuring projecting portions that engage in a noncontact state to form a labyrinth seal, preventing sputtered particles from reaching the substrate holder during conditioning and target cleaning, thereby maintaining film quality and reducing contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a single shutter is used to prevent sputtered particle adhesion, then substrate contamination is reduced, but particle generation occurs due to shutter contact with the substrate holder
Solution Approach 1:
The single shutter is divided into two separate shutters: a first shutter that prevents sputtered particles from reaching the substrate holder, and a second shutter that prevents particles from adhering to the substrate. This segmentation eliminates the need for one shutter to perform multiple functions, thereby preventing particle generation that occurs when a single shutter contacts the substrate holder during operation.
2Object-affected harmful factors
If the shutter is positioned close to the substrate holder to prevent particle adhesion, then substrate contamination is reduced, but the complexity of the apparatus increases
Solution Approach 1:
Each shutter is designed to perform its specific function independently: the first shutter handles particle prevention at the substrate holder level, while the second shutter handles substrate protection. This functional specialization allows each component to be optimized for its specific task without requiring complex positioning mechanisms, thereby reducing overall apparatus complexity while maintaining effective contamination prevention.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents sputtered particle adhesion to the substrate holder, ensuring stable film quality and reducing contamination, as demonstrated by significantly lower particle detection on the substrate surface compared to traditional methods.
Implementation Method 1
A plasma is generated by applying a high voltage to the target, thereby adhering the target material to the substrate held by the substrate holder using the sputtering phenomenon of the target caused by charged particles in the discharged plasma.
Implementation Method 2
A plasma is generated by applying a high voltage to the target, thereby adhering the target material to the substrate held by the substrate holder using the sputtering phenomenon of the target caused by charged particles in the discharged plasma.
Data Source
AI summary
An electronic device manufacturing method includes a first step of moving a substrate holder close to a first shield member and locating a first projecting portion formed on the first shield member and having a ring shape and a second projecting portion having a ring shape and formed on a second shield member installed on the surface of the substrate holder at the outer peripheral portion of a substrate at a position to engage with each other in a noncontact state, a second step of, after the first step, sputtering a target while maintaining the first projecting portion and the second projecting portion at the position to engage with each other in the noncontact state, and a third step of, after the second step, setting the first shield member in an open state and sputtering the target to perform deposition on the substrate.