Multi-Target Sputtering Shutter Plates for Vacuum Composition Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current sputtering methods for forming thin films in semiconductor devices are limited by the need to expose vacuum apparatus to the atmosphere for composition adjustments, leading to increased development costs and time, and are restricted in the number of targets that can be sputtered simultaneously.
Innovation Solution
A multi-target sputtering apparatus with independently rotating shutter plates allows for the simultaneous sputtering of multiple targets by controlling the positional combination of openings, enabling arbitrary selection and arrangement of targets within the vacuum chamber without atmospheric exposure, thereby increasing the degree of freedom in target combination and reducing development time and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single shutter plate is used for target selection, then the apparatus structure is simple, but the number of targets that can be sputtered simultaneously is limited
Solution Approach 1:
The single shutter plate is divided into multiple independent shutter plates (first shutter plate, second shutter plate, third shutter plate). Each shutter plate can independently control the exposure of different target electrodes, allowing multiple targets to be sputtered simultaneously while maintaining manageable structural complexity
Solution Approach 2:
The shutter control mechanism transitions from a single-plane rotation to a multi-plane stacked configuration. The shutter plates are arranged in the vertical dimension, allowing independent control of different target groups without interfering with each other's rotation, thus increasing the number of simultaneously sputterable targets
2Ease of manufacture
If the shutter plate structure is simplified, then the apparatus is easier to manufacture, but the flexibility in target combination is reduced
Solution Approach 1:
The shutter system is segmented into multiple independent plates, each with its own rotation mechanism. This allows each shutter plate to be manufactured and adjusted independently, simplifying the manufacturing process while enabling flexible combination of different target materials by controlling which plates are rotated to expose which targets
Solution Approach 2:
The shutter plates are designed to rotate independently around the same axis, providing dynamic control over target exposure. This rotational freedom allows any combination of targets to be selected and sputtered simultaneously, maximizing adaptability while maintaining a relatively simple stacked disk structure
3Manufacturing precision
If composition adjustment is performed by changing targets in atmospheric exposure, then the target composition can be precisely controlled, but the development time and cost increase
Solution Approach 1:
The multi-target sputtering system allows continuous composition adjustment without breaking the vacuum. Multiple targets are pre-installed in the vacuum chamber, and their exposure is controlled continuously through shutter plate rotation, eliminating the time-consuming process of atmospheric exposure and target replacement while maintaining precise composition control
Solution Approach 2:
Multiple target electrodes with different materials are pre-installed in the vacuum chamber before the sputtering process begins. The shutter plates are positioned to control exposure of these pre-installed targets, allowing composition adjustments to be made by simply rotating shutters rather than physically replacing targets during the process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for more flexible and efficient composition adjustment of thin films, enabling the development of novel materials at lower costs and in shorter times by increasing the number of targets that can be sputtered simultaneously within the vacuum chamber.
Implementation Method 1
The present invention relates to a sputtering apparatus for forming thin films on a semiconductor substrate such as silicon, or on a substrate of metal, glass, ceramics, plastics or the like, in vacuum
Data Source
AI summary
The present invention provides a multi-target sputtering apparatus including an increased number of targets which can be sputtered simultaneously, and a method for controlling the sputtering apparatus. In one embodiment of the present invention, first and second shutter plates are provided between a substrate and target electrodes and paths between intended targets and the substrate are shut off by the shutter plates to perform a pre-sputtering step. In addition, the first and second shutter plates are rotated as appropriate at the time of transition to a full-scale sputtering step, so as to overlap through-holes provided in the shutter plates, thereby opening up paths between the intended targets and the substrate. Then, a full-scale sputtering step is performed.