Sputtering Shutter Reflector Layout for Vacuum Purity and Pump Protection
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Solution Overview
Problem
In sputtering apparatuses, a heated shutter moving to the exhaust pump side can release adsorbed gases into the vacuum chamber, causing impurities and potentially leading to faults in the exhaust pump due to thermal expansion and heat conduction.
Innovation Solution
A plate-shaped reflector is positioned between the exhaust pump and the shutter to reflect radiation heat from the shutter, reducing heat conduction and preventing gas release into the vacuum chamber, thus preventing exhaust pump faults.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the shutter is heated during target cleaning to improve cleaning efficiency, then the target cleaning effectiveness is improved, but the shutter releases adsorbed gases into the vacuum chamber causing impurities
Solution Approach 1:
A radiation shield is introduced as an intermediary component between the heated shutter and the exhaust pump. This shield blocks thermal radiation from reaching the exhaust pump, preventing the release of adsorbed gases while allowing the shutter to remain heated for effective target cleaning.
Solution Approach 2:
The harmful thermal radiation is extracted from the heat transfer path by placing the radiation shield. The shield selectively blocks the radiation while allowing the shutter to maintain its heating function, separating the useful heating effect from the harmful gas release effect.
2Productivity
If the heated shutter is moved to the exhaust pump side to enable thin film deposition, then the deposition process can proceed, but thermal expansion and heat conduction cause exhaust pump faults
Solution Approach 1:
The radiation shield serves as a protective intermediary between the heated shutter and the exhaust pump. It blocks thermal radiation and reduces heat conduction, protecting the exhaust pump from thermal damage while allowing the shutter to remain in position for continuous thin film deposition.
Solution Approach 2:
The radiation shield is positioned in advance to prevent thermal damage to the exhaust pump before heat can cause faults. This protective measure is in place before any thermal expansion or heat conduction issues can occur, ensuring reliable exhaust pump operation during deposition.
3Productivity
If the shutter remains in the heated state during thin film deposition to maintain process continuity, then deposition efficiency is improved, but adsorbed gases continue to be released into the vacuum chamber
Solution Approach 1:
The radiation shield continuously blocks thermal radiation from the heated shutter during thin film deposition, preventing the release of adsorbed gases while allowing the shutter to remain heated for process continuity and efficiency.
4Device complexity
If no radiation shield is used to simplify the device structure, then device complexity is reduced, but thermal radiation causes gas release and exhaust pump faults
Solution Approach 1:
A radiation shield is introduced as a simple intermediary component that effectively blocks thermal radiation. This single addition protects against gas release and exhaust pump faults without significantly increasing device complexity, maintaining operational reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The reflector effectively reduces the release of adsorbed gases into the vacuum chamber and prevents exhaust pump faults by minimizing heat conduction from the heated shutter, maintaining a stable environment for thin film deposition.
Implementation Method 1
A plate-shaped reflector is arranged between the exhaust pump and the shutter in a moved-out state in which the shutter is arranged at the shutter-moved-out position, and is configured to reflect radiation of heat directing to the exhaust pump from the shutter in the moved-out state
Data Source
AI summary
A sputtering apparatus (100) according to this invention includes a shutter (50) configured to move between a shutter-closed position (50a) in which the to-be-deposited object (2) is covered from the target (1), and a shutter-moved-out position (50b) in which the shutter is moved out of the shutter-closed position (50a) to an exhaust pump (30) side and stays on the exhaust pump side during thin film deposition. A plate-shaped reflector (60, 70) is arranged between the exhaust pump (30) and the shutter (50) in a moved-out state in which the shutter is arranged at the shutter-moved-out position (50b), and is configured to reflect radiation of heat directing to the exhaust pump (30) from the shutter (50) in the moved-out state.