Sputtering Source Catcher Plate Particle Blocking
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Solution Overview
Problem
Existing sputtering technologies cause significant damage to substrates during the deposition of oxide layers due to high-energy particles, leading to changes in the atomic structure and increased risk of flaking or peeling of catcher plate materials, which reduces uptime and affects the quality of the coating.
Innovation Solution
A sputtering source with two plate-shaped targets and a catcher plate arrangement that restricts the open coating outlet area, preventing high-energy particles from reaching the substrate and minimizing damage by blocking their impact and preventing material peeling or flaking onto the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional sputtering technology is used to deposit oxide layers, then coating can be achieved, but significant substrate damage occurs due to high-energy particles
Solution Approach 1:
The sputtering source is divided into two separate plate-shaped targets instead of using a single target. This segmentation allows independent control of material deposition and reduces the energy of particles reaching the substrate, thereby decreasing substrate damage while maintaining coating quality.
Solution Approach 2:
A catcher plate arrangement is introduced as an intermediary component between the sputtering targets and the substrate. This catcher plate blocks high-energy particles from directly reaching the substrate, acting as a mediator that protects the substrate from damage while allowing the coating process to continue.
2Productivity
If high-energy particles are allowed to reach the substrate, then deposition process is efficient, but atomic structure changes and dislocations occur
Solution Approach 1:
The catcher plate serves as an intermediary that filters out high-energy particles while allowing lower-energy coating material to reach the substrate. This maintains deposition efficiency by preserving the coating process while protecting the atomic structure from damage-induced dislocations.
Solution Approach 2:
The dual-target configuration changes the energy parameters of the sputtered particles. By using two targets with specific geometries and spacing, the particle energy is reduced before reaching the substrate, preventing atomic structure changes and dislocations while maintaining adequate deposition rates.
3Object-affected harmful factors
If catcher plate is positioned close to targets, then high-energy particles are blocked effectively, but coating outlet area is reduced
Solution Approach 1:
The catcher plate is positioned in a specific spatial arrangement relative to the dual targets, utilizing three-dimensional space optimization. By strategically placing the catcher plate at specific coordinates rather than simply close to or far from the targets, effective particle blocking is achieved while preserving adequate coating outlet area for material flow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces substrate damage and extends the uptime of the sputtering source by blocking high-energy particles and preventing material deposition on the substrate, resulting in improved coating quality and reduced maintenance needs.
Implementation Method 1
Each magnet arrangement generates a magnetic field in the reaction space whereby the magnetic field impinges on and/or emanates form and is distributed along at least a predominant part of the respective sputtering surfaces
Implementation Method 2
a sputtering source conceived to sputter-coat a substrate with an oxide layer
Implementation Method 3
an electric field generated between the anode arrangement and the respective target has a local maximum of strength
Implementation Method 4
a sputtering plasma as a negative ion
Data Source
Figure 1
Figure 2a~2e
Figure 3~5
AI summary
A sputtering source comprises two facing plate shaped targets (5, 7) and a magnet arrangement (185,187) along each of the targets. An open coating outlet area (12) from the reaction space between the targets is limited by facing rims (9, 10) of the two plate shaped targets. Catcher plates (207, 205) along each of the rims respectively project in a direction from the rims towards each other into the open coating outlet area (12), thereby restricting the open coating outlet area (12) as limited by the mutually facing rims (9,10) of the two plate shaped targets.