Sputtering Equipment with Staggered Targets and Protruding Substrates

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Solution Overview

Problem

Conventional sputtering processes are time-consuming and result in material waste, as they can only process one substrate at a time, and are prone to defects in coating layers due to the target facing the main surface, which is not necessary for the in-plane area of liquid crystal panels.

Innovation Solution

A sputtering equipment and method that allows multiple substrates to be processed simultaneously by using a carrier box with protruding side surfaces to face a target set with staggered targets, reducing the need for repeated processing and minimizing defects by focusing on side surfaces between pads.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional sputtering process processes one substrate at a time with target facing main surface, then coating can be formed on substrate, but processing time is excessive and material waste occurs

Engineering Contradiction:

Improveprocessing efficiencyVSAvoidprocessing time

Core Design Contradiction:

ProductivityVSLoss of time

Solution Approach 1:

Multiple substrates are placed side-by-side in the carrier box and sputtered simultaneously by a single target, merging multiple processing operations into one. This combines the functionality of multiple sequential sputtering operations into a single parallel operation, dramatically improving productivity and reducing processing time

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The invention changes the processing dimension from sequential (one substrate at a time) to parallel (multiple substrates simultaneously). By arranging substrates in the width dimension of the carrier box and exposing their side surfaces to the target, the system achieves multi-substrate processing in a single operation cycle

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Loss of substance

If target sputters main surface of substrate, then coating layer is formed, but material waste occurs on in-plane area that does not need coating

Engineering Contradiction:

Improvematerial wasteVSAvoidcoating accuracy

Core Design Contradiction:

Loss of substanceVSManufacturing precision

Solution Approach 1:

The invention applies coating only to the specific side surface areas that require electrical connection between pads, rather than coating the entire main surface. By exposing and sputtering only the necessary side surface regions, material is deposited precisely where needed, eliminating waste on in-plane areas that do not require coating

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The invention extracts and processes only the necessary portions of the substrate (side surfaces between pads) rather than the entire substrate. By removing substrates from the carrier box and exposing only the required side surface areas to the target, the process eliminates unnecessary material deposition on areas that don't need coating

Inventive Principle:

Principle #2Taking out (Extraction)

3Reliability

If target faces main surface for sputtering, then coating layer is formed, but defects occur in coating layer beside pads near side surfaces

Engineering Contradiction:

Improvecoating qualityVSAvoidcoating uniformity

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

Instead of sputtering the main surface of the substrate (conventional approach), the invention inverts the approach by sputtering the side surfaces of the substrates. By rotating or positioning substrates so that side surfaces face the target, the coating is deposited on the previously problematic areas, achieving uniform coating without defects in the regions beside pads near side surfaces

Inventive Principle:

Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces material waste and defect probability in coating layers while improving the efficiency of the sputtering process by enabling simultaneous processing of multiple substrates and enhancing coating uniformity.

Implementation Method 1

the at least one target set sputtering the at least one side surface of each substrate

Methodology Applied

Scientific EffectSputtering: Sputtering

Data Source

PatentUS11626272B2Sputtering equipment and operation method thereof

Publication Date: 2023.04.11 AU OPTRONICS CORP

AI summary

A sputtering equipment is adapted for sputtering substrates, where each of the substrates includes two opposite main surfaces and side surfaces connecting the two main surfaces. The sputtering equipment includes a cavity, at least one target set and a carrier box. The at least one target set is disposed in the cavity, the target set includes targets, and the targets are staggered at both side surfaces of an axis. The carrier box is movably disposed so as to enter and exit the cavity, and includes substrate accommodating grooves. The substrates are adapted for being placed in the substrate accommodating grooves of the carrier box, and at least one side surface of each of the substrates is located outside the carrier box and protrudes toward the at least one target set.