Sputtering Apparatus Substrate Swing Mechanism for Particle Control
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Solution Overview
Problem
Existing sputtering apparatuses face challenges with unnecessary particle generation, especially from movable components, leading to increased manufacturing costs, complex vacuum sealed structures, and space inefficiencies, particularly when handling large substrates.
Innovation Solution
A sputtering apparatus design that allows the substrate to swing relative to the target without swinging the target, utilizing vertical and lateral deposition preventing plates to minimize particle deposition on non-processing areas, reducing the swing range of the substrate and maintaining deposition uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a magnet or cathode is swung to improve deposition uniformity, then deposition uniformity is improved, but dust and particles are generated from friction portions
Solution Approach 1:
Instead of swinging the magnet or cathode to achieve deposition uniformity, the patent inverts the approach by swinging the substrate holder. This eliminates friction between moving parts and reduces particle generation while maintaining the benefit of improved deposition uniformity through relative motion.
Solution Approach 2:
The patent extracts the moving part from the magnet/cathode side and relocates it to the substrate holder side. This allows the magnet and cathode to remain stationary, eliminating the source of particle generation while preserving the functional benefit of motion for deposition uniformity.
2Object-generated harmful factors
If an internal chamber is provided to seal the drive unit, then particle generation is reduced, but the vacuum sealed structure becomes complicated and manufacturing costs increase
Solution Approach 1:
The patent extracts the drive unit from the vacuum chamber, placing it externally. This eliminates the need for complex internal vacuum-sealed chambers while still preventing particle generation, as there are no internal moving parts to create dust within the vacuum environment.
Solution Approach 2:
The substrate holder acts as an intermediary, allowing the substrate to move relative to the target without requiring the magnet or cathode to move. This mediator approach achieves deposition uniformity while keeping the vacuum chamber simple and free of internal moving parts.
3Object-generated harmful factors
If the swing range of the substrate is reduced, then particle generation is reduced, but deposition uniformity may be affected
Solution Approach 1:
The patent applies local quality by using deposition preventing plates at specific locations to control where deposition occurs. This allows a smaller swing range while maintaining deposition uniformity on the substrate surface through localized control of deposition patterns.
4Object-generated harmful factors
If vertical and lateral deposition preventing plates are added, then particle deposition on non-processing areas is minimized, but device complexity increases
Solution Approach 1:
The patent segments the deposition control function by adding separate vertical and lateral deposition preventing plates. These segmented components work together to minimize unnecessary deposition on non-processing areas while maintaining relative simplicity through modular design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces particle generation, maintains deposition uniformity, and achieves space savings by minimizing the deposition area, thereby improving yield and reducing maintenance time and costs.
Implementation Method 1
a sputtering apparatus which performs deposition on a substrate to be processed using a sputtering method
Implementation Method 2
a magnetron cathode
Data Source
AI summary
A sputtering apparatus of the present invention is an apparatus performing deposition on a substrate to be processed using a sputtering method and includes a vacuum chamber, a target provided on a surface of a cathode provided in the vacuum chamber, a substrate holder provided in the vacuum chamber to face the target, and a swing unit that causes the substrate holder to be swingable with respect to the target. A swing region of the substrate to be processed in the substrate holder is set to be smaller than an erosion region of the target.