Mg-Alloyed Sputtering Target Bonding for Peel-Resistant Interfaces
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Solution Overview
Problem
In sputtering targets composed of multiple members, including a target material and a base material, the first member and second member may not be sufficiently firmly bonded, leading to potential peeling at the bonding interface due to thermal expansion and cooling shrinkage.
Innovation Solution
A sputtering target is designed with a first member containing Al and a second member containing Cu, both of which include Mg. An alloy layer containing Al and Cu, with an Mg-containing layer having 5.0 at % or more of Mg, is formed between the first and second members to enhance bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a first member and a second member are laminated to form a sputtering target, then the functional requirements for thin film formation are met, but the bonding between members is insufficient and peeling occurs during thermal expansion and cooling
Solution Approach 1:
An alloy layer containing Al and Cu is introduced as an intermediary between the first member (Al-containing) and second member (Cu-containing). This intermediate layer facilitates metallurgical bonding between the dissimilar materials, preventing direct contact and reducing thermal stress concentration at the interface. The alloy layer acts as a buffer zone that accommodates differential thermal expansion while maintaining bond integrity during sputtering operations.
Solution Approach 2:
The sputtering target employs a composite structure consisting of multiple members with different material compositions (Al-containing, Cu-containing) bonded together through a specially designed alloy layer. This composite construction allows each member to contribute its specific properties (electrical conductivity, sputtering characteristics, thermal management) while the overall structure maintains bonding strength through the intermediate alloy layer that is compositionally graded to reduce interface stress.
2Reliability
If an alloy layer containing Al and Cu is formed between members, then bonding is improved, but the complexity of the target structure increases
Solution Approach 1:
The alloy layer is localized specifically at the bonding interface between the first and second members, rather than being distributed throughout the entire target structure. This localized application of the Al-Cu alloy provides the necessary bonding function precisely where thermal stress and shear forces are concentrated at the interface, while the bulk members maintain their original material properties and simpler structures. The local quality approach minimizes overall complexity while maximizing bonding reliability at the critical interface zone.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The described configuration achieves firm bonding between the first and second members, preventing peeling and ensuring stable sputtering performance.
Implementation Method 1
a first member and a second member to be laminated to each other may not be sufficiently firmly bonded to each other... warpage fluctuations due to thermal expansion during sputtering and shrinkage during cooling may cause peeling at the bonding interface
Data Source
AI summary
A sputtering target comprised of a plurality of members including a target material and a base material, wherein the plurality of members includes a first member and a second member laminated to each other, wherein the first member contains Al, and the second member contains Cu, wherein at least one of the first member and the second member contains Mg, wherein the sputtering target includes an alloy layer containing Al and Cu between the first member and the second member, the alloy layer being in contact with the first member and the second member, and wherein the alloy layer further includes an Mg-containing layer containing 5.0 at % or more of Mg in at least a part of the alloy layer.