Sputtering Target Bonding for Peel-Resistant Large Targets
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The conventional method of bonding a sputtering target is insufficient, leading to a low bonding rate and large maximum defect areas, resulting in the target material peeling off during sputtering.
Innovation Solution
An improved method of bonding a sputtering target involves applying a bonding material to a backing plate, sliding the target material to cover the bonding region, and reversing it to ensure complete coverage, resulting in a bonding rate of 97% or more and a maximum defect area of 0.6% or less.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the conventional bonding method is used, then the bonding process can be completed, but the bonding rate is low and the maximum defect area is large
Solution Approach 1:
The bonding material is applied to the backing plate before the target material is placed, and the target material is then slid across the bonding region to distribute the bonding material uniformly. This preliminary preparation ensures complete coverage and eliminates gaps that would cause defects and peeling during sputtering.
Solution Approach 2:
Instead of statically placing the target material, the invention employs a dynamic sliding motion where the target material is moved across the bonding region. This dynamic approach ensures uniform distribution of bonding material and complete coverage, achieving a bonding rate of 97% or more while reducing maximum defect area to 0.6% or less.
2Manufacturing precision
If the target material is slid only in one direction, then the bonding process is simple, but the coverage is incomplete and defects remain
Solution Approach 1:
The bonding process is segmented into two distinct sliding phases: a first sliding process in one direction and a second sliding process in the opposite direction. This segmentation ensures that the bonding material is distributed uniformly across the entire bonding region, achieving complete coverage with a bonding rate of 97% or more while keeping each individual sliding action simple.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly improves the bonding rate and reduces the maximum defect area, preventing the target material from peeling off during sputtering, even for large or elongated targets.
Implementation Method 1
the target material and the backing plate are relatively moved and overlapped while being rubbed with each other
Implementation Method 2
a target material and a backing plate with a bonding material, wherein the target material is bonded via the bonding material to a bonding region of the backing plate
Data Source
AI summary
A sputtering target comprising:a backing plate; anda target material bonded via a bonding material to a bonding region of the backing plate, whereina bonding area of a bonding portion between the target material and the backing plate accounts for 97% or more of the area of the bonding region, and whereina maximum defect area of portions without the bonding material present between the target material and the backing plate accounts for 0.6% or less of the area of the bonding region.The sputtering target enables manufacturing of the sputtering target in which the target material is hardly peeled off during sputtering.