Sputtering Target Structure With Non-Bonding Cooling Jacket Interface

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Solution Overview

Problem

Existing film forming apparatuses for semiconductor devices face challenges in efficiently cooling targets during sputtering processes, leading to potential target melting and contamination issues due to inadequate heat management and bonding configurations.

Innovation Solution

A target structure comprising a target bonded to a cooling jacket with a flow path for a heat exchange medium and a backing plate, where the cooling jacket is more flexible and deforms to follow thermal expansion, and a non-bonding region to prevent peeling, combined with a film forming apparatus that allows for simultaneous metal deposition and oxidation within the same processing container.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If the cooling jacket is rigidly bonded to the backing plate across the entire peripheral portion, then structural stability is improved, but thermal expansion stress causes peeling at the bonding interface

Engineering Contradiction:

Improvestructural stabilityVSAvoidbonding interface reliability

Core Design Contradiction:

Stability of the object's compositionVSReliability

Solution Approach 1:

The bonding interface is segmented into a first bonding region and a second bonding region. The first bonding region bonds the cooling jacket to the backing plate, while the second bonding region leaves a gap between them. This segmentation allows differential thermal expansion in different regions, preventing peeling while maintaining structural stability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the bonding interface have different bonding characteristics. The first bonding region has full contact bonding for structural support, while the second bonding region has a gap to accommodate thermal expansion. This local differentiation resolves the contradiction between stability and reliability.

Inventive Principle:

Principle #3Local quality

2Temperature

If the target is continuously cooled, then target melting is prevented, but heat exchange efficiency decreases due to thermal stress and bonding degradation

Engineering Contradiction:

Improvetarget temperature controlVSAvoidcooling system reliability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The gap in the second bonding region serves as a pre-designed cushioning space that accommodates thermal expansion before it can cause damage. This beforehand cushioning prevents bonding degradation while maintaining continuous cooling capability, resolving the contradiction between temperature control and system reliability.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Reliability

If the cooling jacket is made flexible to accommodate thermal expansion, then peeling is prevented, but structural support strength decreases

Engineering Contradiction:

Improvebonding interface reliabilityVSAvoidstructural support strength

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The bonding interface is divided into two functional regions: the first bonding region provides structural support through rigid bonding, while the second bonding region provides flexibility through a gap design. This segmentation allows the system to simultaneously achieve both reliability and strength.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the cooling jacket have different structural characteristics. The first bonding region maintains rigidity for support, while the second bonding region allows flexibility for thermal accommodation. This local quality differentiation resolves the contradiction between strength and reliability.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively manages heat, prevents target melting, reduces contamination, and enhances the efficiency of the sputtering process by allowing for flexible heat dissipation and reuse of the target structure, while also shortening the time required for forming metal oxide layers.

Implementation Method 1

a cooling jacket (130) having a flow path (133) through which a heat exchange medium flows

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a flow path (133) through which a heat exchange medium flows

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

the cooling jacket (130) and the backing plate (150) are not bonded in a non-bonding region (145) inside the peripheral portion

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 4

a film forming apparatus is used to form a metal film on a substrate by sputtering

Methodology Applied

Scientific EffectSputtering: Sputtering

Implementation Method 5

allows for simultaneous metal deposition and oxidation within the same processing container

Methodology Applied

Scientific EffectOxidation: Oxidation

Data Source

PatentUS11823880B2Target structure and film forming apparatus

Publication Date: 2023.11.21 TOKYO ELECTRON LTD

AI summary

A target structure includes a target, a cooling jacket having a flow path through which a heat exchange medium flows, and a backing plate. The target is bonded to one surface of the cooling jacket. A remaining surface of the cooling jacket and the backing plate are bonded in a peripheral portion, and are not bonded in a non-bonding region inside the peripheral portion.