Sputtering Target Sidewall Heat Sink Thermal Management
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Solution Overview
Problem
Sputtering targets often develop defects such as whiskers or nodules during the sputtering process, leading to damage and deterioration of the deposited layer quality due to heat concentration in specific regions.
Innovation Solution
A sputtering target design featuring a base that transfers heat in a basal plane direction and a heat sink on the sidewall to distribute and radiate heat efficiently, preventing heat concentration and reducing the likelihood of defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat is transferred only in the basal plane direction, then the base structure is simple, but heat concentration occurs in specific regions leading to defects
Solution Approach 1:
The base is divided into a first base portion and a second base portion with different thermal conductivity characteristics. The first base portion has high thermal conductivity in the thickness direction to transfer heat from the sputtering surface, while the second base portion has high thermal conductivity in the radial direction to distribute heat laterally, preventing heat concentration and defect formation.
Solution Approach 2:
Different regions of the base are assigned different thermal conductivity properties tailored to their specific functions. The first base portion (near the sputtering surface) prioritizes vertical heat transfer, while the second base portion (peripheral region) prioritizes radial heat distribution, creating localized thermal management zones that prevent hot spots.
2Reliability
If a heat sink is added to the sidewall, then heat distribution improves and defects are reduced, but the manufacturing process becomes more complex
Solution Approach 1:
The sidewall is pre-formed with a recessed portion before the sputtering target material is deposited. This recessed sidewall structure is created in advance to facilitate subsequent heat sink attachment, ensuring proper positioning and thermal contact while simplifying the overall manufacturing sequence.
Solution Approach 2:
The recessed sidewall acts as an intermediary structure that mediates between the base and the heat sink. It provides a dedicated mounting interface that ensures reliable thermal contact and mechanical attachment, facilitating efficient heat transfer from the base to the heat sink without requiring complex bonding or alignment processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively distributes and radiates heat, reducing the occurrence of defects and improving the quality of the deposited layer by preventing heat concentration, thus enhancing the reliability and performance of the sputtering target.
Implementation Method 1
a base configured to transfer heat in a basal plane direction
Implementation Method 2
a first heat sink disposed on a sidewall of the base, the first heat sink configured to transfer heat along a direction that is different from the basal plane direction
Data Source
AI summary
A sputtering target includes: a base configured to transfer heat in a basal plane direction; and a first heat sink disposed on a sidewall of the base, the first heat sink configured to transfer heat along a direction that is different from the basal plane direction.