Sputtering Target Bonding With Non-Adhesive Masking Against Impurities
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Solution Overview
Problem
Sputtering targets with higher water absorption, such as IGZO and ceramic-based targets, face issues with impurity penetration during bonding due to water absorption and oil absorption through grain boundaries or microcracks, leading to material deterioration.
Innovation Solution
A sputtering target and manufacturing method involving masking with a non-adhesive tape to suppress impurity penetration, where the target material is laminated on a base, covered with an inorganic material, and bonded using a heat-resistant non-adhesive tape to prevent adhesive components from entering the target material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If masking adhesive sheet with fluororesin base material and silicon adhesive layer is used to mask the outer peripheral portion of bonding material, then the bonding process can be performed, but water absorption and oil absorption occur via grain boundaries or microcracks in water-absorbing target materials such as IGZO and ceramic-based targets, leading to impurity penetration and material deterioration
Solution Approach 1:
The invention extracts and removes the adhesive layer component from the masking tape structure. By using a masking tape without an adhesive layer (non-adhesive masking tape), the source of impurity penetration is eliminated, preventing adhesive components from entering grain boundaries or microcracks in the target material during the bonding process.
Solution Approach 2:
The invention introduces a non-adhesive masking tape as an intermediary material between the bonding material and the environment. This intermediary serves the masking function while not introducing harmful adhesive substances that could penetrate the target material, thus mediating between the need for masking and the need to prevent contamination.
2Ease of operation
If conventional masking tape with adhesive layer is used for bonding, then masking can be performed, but the adhesive components permeate into the inner side of water-absorbing and oil-absorbing target material, causing deterioration
Solution Approach 1:
The adhesive layer is extracted and removed from the masking tape structure. The resulting non-adhesive masking tape maintains the masking function while eliminating the source of contamination that would otherwise permeate into the target material and compromise its integrity.
Solution Approach 2:
The invention uses a disposable non-adhesive masking tape that serves its masking purpose during the bonding process and is then removed. This disposable approach avoids the need for adhesive bonding while preventing contamination of the target material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves a low impurity concentration and reduced water absorption rate, maintaining target material integrity by preventing adhesive components from adhering to the target, resulting in a sputtering target with improved durability and reduced contamination.
Implementation Method 1
water absorption and oil absorption may occur via grain boundaries in the structure or microcracks in grains
Implementation Method 2
covering a side face and a surface of the target material with an inorganic covering material
Implementation Method 3
bonding the target material and the base material by heating the masked target material
Implementation Method 4
an intensity ratio (B/A) of a minimum reflection intensity B to a maximum reflection intensity A of a back surface wave of a target material as measured by a water immersion ultrasonic flaw detection inspection
Data Source
AI summary
Provided a sputtering target and a method for manufacturing the sputtering target, in which a penetration of impurities into the target material during bonding is suppressed A sputtering target, wherein an intensity ratio (B/A) of a minimum reflection intensity B to a maximum reflection intensity A of a back surface wave of a target material as measured by a water immersion ultrasonic flaw detection inspection after bonding the target material is 0.70 or more, and wherein a water absorption rate of the target material determined by a relationship of a weight change rate (100×(a−b)/b) is 0.01% to 1.0%, where (a) is a weight after immersion as measured after immersing the target material in water for 10 hours and removing the water on a surface, and (b) is a dry weight of the target material before the immersion.