Real-Time Target Material Monitoring in Physical Sputtering
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Solution Overview
Problem
In the manufacturing of thin film transistors, the consumption of target materials in physical vapor deposition machines is not monitored in real time, leading to potential breakdown and product abnormalities due to incomplete or excessive use of materials.
Innovation Solution
An apparatus and method for film formation by physical sputtering that includes a vacuum chamber, a substrate platform, a target material, square resistance meters connected to the target material to measure its resistance in real time, and a control system that compares the actual resistance value with a critical threshold to issue an alarm for timely replacement, preventing material breakdown and optimizing usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If real-time monitoring of target material consumption is implemented, then product quality and material utilization are improved, but device complexity increases
Solution Approach 1:
The patent replaces manual inspection and estimation methods with automated electrical resistance measurement. The square resistance meter automatically measures the resistance of the target material, and the control system automatically compares the measured resistance with preset thresholds to determine consumption status, eliminating the need for manual intervention and reducing operational complexity.
Solution Approach 2:
The target material itself serves as the sensing element by utilizing its inherent electrical resistance property. The material's own resistance change indicates its consumption state, eliminating the need for separate sensors or complex detection mechanisms. This self-indicating approach simplifies the overall system while providing reliable monitoring.
2Loss of substance
If manual inspection of target material consumption is performed, then device complexity remains low, but material waste increases due to incomplete utilization
Solution Approach 1:
The system continuously measures the resistance of the target material and provides real-time feedback to the control system. When the resistance reaches a preset threshold indicating near-complete consumption, the system issues an alarm to prompt timely replacement, ensuring maximum utilization of the target material while preventing breakdown and waste.
Solution Approach 2:
The system performs preliminary detection of target material consumption status through resistance measurement before actual breakdown occurs. By monitoring resistance changes that precede complete consumption, the system enables proactive replacement scheduling, maximizing material utilization and preventing operational disruptions.
3Device complexity
If no monitoring system is used, then device complexity is minimized, but target material breakdown causes backboard damage and product abnormalities
Solution Approach 1:
The patent employs simple electrical resistance measurement instead of complex mechanical or optical monitoring systems. The square resistance meter and control system provide automated monitoring with minimal structural addition, achieving reliable detection of target material status while maintaining simplicity and avoiding the need for sophisticated detection apparatus.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for real-time monitoring of target material consumption, preventing damage and abnormalities, improving product quality, and reducing material waste by ensuring complete utilization of the target material.
Implementation Method 1
at least one square resistance meter, which is connected to the target material to real-timely measure an actual resistance value of the target material
Implementation Method 2
The working principle of PVD is to use Ar ions in a plasma to bombard a target material for sputtering the atoms of the target material and transferring the atoms to a surface of the glass substrate
Implementation Method 3
The working principle of PVD is to use Ar ions in a plasma to bombard a target material for sputtering the atoms of the target material and transferring the atoms to a surface of the glass substrate
Data Source
AI summary
Disclosed is an apparatus for film formation by physical sputtering, which includes a vacuum chamber; a substrate platform arranged inside of the chamber, and provided thereon with a substrate to be formed with a film; a target material arranged inside of the chamber, and arranged opposite to the substrate; at least one square resistance meter, which is connected to the target material to real-timely measure an actual resistance value of the target material; an excitation source, which is used to bombard the target material for sputtering atoms of the target material; and a control system, which is connected to the square resistance meter. The apparatus for film formation by physical sputtering has a simple structure, can monitor the consumption of the target material in real time, effectively avoid damage of a backboard and abnormality of a product resulting from breakdown of the target material, and improve the quality of the product. Meantime, the use efficiency of the target material can be improved and thus the waste of the material, which would otherwise be caused by incomplete use of the target material, can be avoided.