SRAM Cell Transistor Layout to Mitigate NBTI Aging

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Solution Overview

Problem

Existing two-port SRAM circuits suffer from Negative Bias Temperature Instability (NBTI) effect, leading to increased threshold voltage of p-type transistors, which results in lower conduction current and worsened static noise margin.

Innovation Solution

Implementing memory cells with n-type transistors as read pass-gate transistors and p-type transistors as write pass-gate transistors, reducing dependence on aging and mitigating the NBTI effect.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If p-type transistors are used as read pass-gate transistors in two-port SRAM circuits, then the circuit can achieve initial functionality, but the threshold voltage increases due to NBTI effect during aging, leading to lower conduction current and worsened static noise margin

Engineering Contradiction:
Improvestatic noise marginVSAvoidaging resistance
Core Design Contradiction:
ReliabilityVSDuration of action of stationary object

Solution Approach 1:

The patent changes the key parameter of transistor type from p-type to n-type for the read pass-gate transistor. This parameter change fundamentally alters the device's response to aging effects, as n-type transistors do not suffer from NBTI degradation, thereby maintaining stable threshold voltage and conduction current over time while preserving the required read functionality

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent inverts the conventional assignment of transistor types in SRAM circuits. Instead of using p-type transistors for read operations (conventional approach), it uses n-type transistors for read pass-gate functions. This inversion resolves the aging-related degradation issue while maintaining circuit functionality through complementary device characteristics

Inventive Principle:
Principle #13The other way round (Inversion)

2Ease of manufacture

If p-type transistors are used in SRAM circuits, then the circuit design follows conventional approaches, but the conduction current decreases over time due to threshold voltage increase from NBTI effect

Engineering Contradiction:
Improveconventional design compatibilityVSAvoidconduction current stability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent changes the transistor type parameter from p-type to n-type for specific functions within the SRAM circuit. This parameter change maintains compatibility with conventional manufacturing processes while fundamentally improving the stability of conduction current by eliminating NBTI-induced threshold voltage shifts that plague p-type transistors

Inventive Principle:
Principle #35Parameter changes

3Reliability

If n-type transistors are used as read pass-gate transistors, then the static noise margin remains stable over time, but the device complexity increases due to mixed transistor type implementation

Engineering Contradiction:
Improvestatic noise margin stabilityVSAvoidtransistor configuration
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies local quality by using different transistor types in different locations within the SRAM circuit based on functional requirements. Specifically, n-type transistors are used for read pass-gate functions where aging resistance is critical, while p-type transistors are used for write pass-gate functions where they traditionally excel. This localized differentiation optimizes overall circuit reliability without requiring complete redesign of the entire circuit

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS20250374505A1Memory devices and methods for manufacturing the same
Publication Date: 2025.12.04 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20250374505A1 patent drawing
  • US20250374505A1 patent drawing
  • US20250374505A1 patent drawing

AI summary

A memory device includes a storage element formed of a first inverter and a second inverter cross-coupled to each other, a first transistor having a first conductive type, and connected between a first bit line and a first storage node of the storage element; a second transistor having the first conductive type, and connected between a second bit line and a second storage node of the storage element; and a third transistor having a second conductive type opposite to the first conductive type, and connected between the first storage node and a third bit line.