SSD Air Tunnel Housing for Semiconductor Chip Heat Dissipation
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Solution Overview
Problem
As electronic devices become more powerful, they generate more heat, leading to reliability issues due to increased power consumption and heat dissipation challenges, particularly in solid state drive (SSD) apparatuses.
Innovation Solution
The SSD apparatus incorporates a case with an air tunnel and heat-dissipating fins, along with thermal interface materials, to enhance heat dissipation by facilitating airflow and thermal conductivity, and includes internal fans to increase airflow speed and heat transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor chips are used in SSD apparatus, then data storage capacity and processing speed are improved, but heat generation increases leading to reliability degradation
Solution Approach 1:
The patent introduces air tunnels that extend in the first direction (horizontal dimension) between the inner plate and upper wall, creating a three-dimensional heat dissipation pathway. This dimensional approach allows heat to be dissipated laterally through airflow rather than relying solely on vertical heat conduction, effectively managing heat from high-density semiconductor chips without compromising reliability
Solution Approach 2:
The patent employs forced convection through air tunnels and heat-dissipating fins to actively manage heat generation. By introducing airflow through the air tunnel structure and utilizing the fins to enhance convective heat transfer, the system effectively removes heat from semiconductor chips, preventing reliability degradation while maintaining high productivity
2Temperature
If heat spreaders with high thermal conductivity are attached to components, then heat dissipation is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges the heat dissipation function with the existing case structure by forming air tunnels between the inner plate and upper wall. This integration approach combines structural support and heat dissipation functions into a unified design, avoiding the need for separate heat spreaders and reducing overall device complexity while maintaining effective heat management
Solution Approach 2:
The inner plate serves multiple functions: it provides structural support for the substrate and semiconductor chips, defines the air tunnel passage for heat dissipation, and acts as a mounting surface. This multi-functionality eliminates the need for dedicated heat spreader components, reducing device complexity while achieving effective heat management
3Temperature
If air tunnels are introduced for heat dissipation, then heat transfer efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent segments the case into distinct functional zones: the inner plate for component mounting, the air tunnel region for heat dissipation, and the upper wall for structural support. This segmentation allows each component to be manufactured and assembled independently with standard tolerances, reducing overall manufacturing precision requirements while maintaining effective heat transfer through the air tunnel structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively increases the heat-dissipating characteristics and reliability of SSD apparatuses by efficiently dissipating heat generated by semiconductor chips, thereby improving their performance and longevity.
Implementation Method 1
A plurality of heat-dissipating fins is disposed on an outer wall of the case with an air passage communicating with the accommodation space
Implementation Method 2
thermal interface materials, to enhance heat dissipation by facilitating airflow and thermal conductivity
Data Source
AI summary
A solid state drive (SSD) apparatus includes a case including an air tunnel disposed between an inner plate and an upper wall and an accommodation space between the inner plate and a lower wall. The air tunnel extends in a first direction, and both end parts of the air tunnel are exposed to the outside. A substrate is disposed in the accommodation space. At least one semiconductor chip is disposed on the substrate.