SSD Case Heat Storage Elements Thermal Buffering
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Solution Overview
Problem
Solid-state drive devices face performance throttling issues due to increased heat generation, leading to reduced performance and potential damage, especially when used in portable applications where external impacts can further compromise reliability.
Innovation Solution
A solid-state drive case design incorporating a pair of heat storage elements and a cover system with a spacing distance, along with an inner frame, to effectively manage heat dissipation and absorb external impacts, thereby delaying the onset of performance throttling and protecting the memory module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If input and output speeds of the solid-state drive device are increased, then productivity is improved, but heat generated increases causing performance throttling
Solution Approach 1:
A heat storage element is introduced as an intermediary component between the memory module and the external environment. This heat storage element absorbs and stores heat generated by the memory module during high-speed operations, acting as a thermal buffer that delays heat transmission to the housing and prevents immediate performance throttling, thereby maintaining high productivity for extended periods
Solution Approach 2:
The heat storage element is positioned in advance between the heat-generating memory module and the housing to provide preemptive thermal cushioning. By storing heat before it can accumulate to critical levels, the system prevents performance degradation before it occurs, allowing sustained high-speed operations
2Adaptability or versatility
If the solid-state drive device is made more compact for portable use, then adaptability is improved, but reliability deteriorates due to increased impact susceptibility
Solution Approach 1:
A cushioning element is positioned between the heat storage element and the housing to provide preemptive mechanical protection. This cushioning element absorbs external impacts before they can reach and damage the memory module, maintaining reliability in portable applications where drops and shocks are common
Solution Approach 2:
The cushioning element is nested within the housing structure, creating a protective layer that surrounds and protects the heat storage element and memory module. This nested configuration provides comprehensive impact protection while maintaining the compact form factor required for portable applications
3Temperature
If heat is dissipated quickly to prevent performance throttling, then temperature is reduced, but the housing may become too hot to touch
Solution Approach 1:
The heat storage element serves as a thermal intermediary that decouples the thermal management of the memory module from the housing. It absorbs heat from the memory module, storing it temporarily, and releases it gradually to the housing through controlled conduction, preventing both overheating of the memory module and excessive heating of the housing surface
Solution Approach 2:
The heat storage element provides thermal cushioning by absorbing heat before it can rapidly transmit to the housing. This prevents sudden temperature spikes in the housing that would make it uncomfortable to touch, while still managing the memory module's temperature effectively
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution extends the operational time of the solid-state drive device in normal performance mode by efficiently managing heat and reducing the impact of external forces, thus preventing damage and maintaining performance.
Implementation Method 1
a pair of heat storage elements including a first heat storage element and a second heat storage element covering an upper part and a lower part of the memory module, respectively, the pair of heat storage elements configured to store heat emitted by the memory module
Implementation Method 2
a cover configured to receive the memory module and the pair of heat storage elements in a space therein; an inner frame between the cover and at least one of the pair of heat storage elements such that the cover is separated from the at least one of the pair of heat storage elements by a spacing distance
Data Source
AI summary
A solid-state drive device includes a memory module in which at least one non-volatile memory device is mounted, a first heat storage unit and a second heat storage unit covering upper and lower parts of the memory module, respectively, to store heat emitted by the memory module, and having at least portions connected to each other, respectively, a cover having a space in which the memory module and the first and second heat storage units are received and arranged with a spacing distance from the first and second heat storage units, respectively, and an inner frame arranged between the cover and at least one of the first and second heat storage units, to provide the spacing distance.