SSD Case with Spaced Securing Element for ESD Protection

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Solution Overview

Problem

Solid State Devices (SSDs) are prone to electrostatic discharge due to higher memory densities, which is exacerbated by their lack of ESD-resistive magnetic recording surfaces, unlike conventional hard drives, and this issue is not adequately addressed by existing technologies.

Innovation Solution

The development of circuit boards and assemblies that are common to multiple form factors, featuring specific connection terminals for different form factors, allowing for secure connection and assembly with a securing element, thereby mitigating the risk of electrostatic discharge.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If SSDs use higher memory densities to improve storage capacity, then storage capacity is improved, but susceptibility to electrostatic discharge increases

Engineering Contradiction:
Improvestorage capacityVSAvoidelectrostatic discharge resistance
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent introduces a dedicated ESD protection circuit as an intermediary component between the memory chips and the external environment. This circuit acts as a mediator that safely dissipates electrostatic discharge before it can damage the high-density memory components, allowing the SSD to maintain both high storage capacity and ESD resistance

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent implements ESD protection measures in advance by incorporating protective circuits and design features before ESD events can occur. The ESD protection circuit is pre-configured to detect and neutralize electrostatic threats before they reach the vulnerable high-density memory chips, cushioning them against potential damage

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

2Reliability

If SSDs eliminate moving parts to improve reliability and EMI resistance, then reliability is improved, but ESD susceptibility increases

Engineering Contradiction:
Improvemechanical reliabilityVSAvoidelectrostatic discharge susceptibility
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a dedicated ESD protection circuit as an intermediary component between the memory chips and the external environment. This circuit acts as a mediator that safely dissipates electrostatic discharge before it can damage the high-density memory components, allowing the SSD to maintain both high storage capacity and ESD resistance

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent converts the harmful electrostatic discharge into a safe pathway by designing ESD protection circuits that provide a controlled discharge route. The harmful ESD energy is redirected through protective components (such as diodes and resistors) that dissipate it safely, transforming a potential failure mode into a controlled protective mechanism

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

3Adaptability or versatility

If circuit boards are designed for multiple form factors with different connection terminals, then adaptability is improved, but device complexity increases

Engineering Contradiction:
Improveform factor compatibilityVSAvoidcircuit board assembly complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent implements a universal circuit board design that incorporates multiple sets of connection terminals (first circuit board connection terminals and second circuit board connection terminals) on the same board. This multi-functional approach allows a single circuit board to support multiple form factors (such as 1.8 inch and 2.5 inch SATA standards) without requiring separate specialized boards, thereby improving adaptability while managing complexity through standardized design patterns

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS9832891B2SSD including a case, securing element, circuit board, and at least one package, and methods of forming the SSD
Publication Date: 2017.11.28 SAMSUNG ELECTRONICS CO LTD
  • US9832891B2 patent drawing
  • US9832891B2 patent drawing
  • US9832891B2 patent drawing

AI summary

Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors. In an example embodiment, the SSD includes a circuit board that is smaller than a case, and the circuit board is secured to the bottom surface of the case by the securing element. The securing element is spaced apart from edges of the case to allow using a circuit board that is smaller than the case.