SSD Heat Dissipation Chamber With EMI/ESD Shielding Sidewalls
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Solution Overview
Problem
Existing solid state drive (SSD) devices face challenges in managing electromagnetic interference (EMI) and electrostatic discharge (ESD) noise while ensuring effective heat dissipation as data processing speeds increase.
Innovation Solution
A semiconductor device design featuring a first case with a heat dissipation chamber assembly, including a heat diffusion chamber and a sidewall structure that surrounds electronic components, uses a heat transfer fluid for efficient heat dissipation and grounds the sidewall structure to shield against EMI/ESD radiation, maintaining a sealed structure without increasing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If data processing speed of SSD device is increased, then productivity is improved, but electromagnetic interference and electrostatic discharge noise increase
Solution Approach 1:
A ground-connected shield structure is introduced as an intermediary element between the electronic components and the external environment. This shield acts as a mediator that blocks electromagnetic interference and electrostatic discharge noise from reaching the components while allowing the high-speed data processing to continue uninterrupted.
2Temperature
If heat dissipation performance is improved, then temperature control is enhanced, but device complexity increases
Solution Approach 1:
The heat dissipation function is merged with the existing case structure by forming a heat dissipation chamber within the case. The heat dissipation performance is enhanced through phase change of a heat transfer fluid within this chamber, while avoiding the need for separate complex cooling systems. The sidewall structure serves dual purposes: providing structural support and acting as an EMI shield.
Solution Approach 2:
A heat transfer fluid undergoing phase change (liquid to vapor and back) is utilized within the heat dissipation chamber to efficiently absorb and release heat. This phase transition mechanism provides high heat dissipation performance while maintaining a relatively simple device structure compared to active cooling systems.
3Reliability
If shield structure is added to protect against EMI/ESD, then reliability is improved, but manufacturing cost increases
Solution Approach 1:
The sidewall structure of the heat dissipation chamber is designed to serve multiple functions simultaneously: it provides structural support for the case, acts as an EMI shield when grounded, and forms part of the sealed chamber for heat transfer fluid. By making this component multi-functional, the shield structure is integrated into existing manufacturing processes without requiring additional separate shielding elements, thus avoiding significant cost increases.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively dissipates heat and shields electronic components from EMI/ESD noise, enhancing performance and reliability while minimizing manufacturing costs.
Implementation Method 1
a heat diffusion chamber in thermal contact with the least one electronic component
Implementation Method 2
The heat diffusion chamber may use a heat transfer fluid, such as vapor, to dissipate heat from the electronic component
Implementation Method 3
since the sidewall structure surrounds the at least one electronic component and is grounded to a ground pattern of the module substrate, it may be possible to shield the at least one electronic component from EMI/ESD radiation noises
Data Source
AI summary
A semiconductor device includes a first case, a second case coupled to the first case to form an inner space, a memory module disposed within the inner space, and including a module substrate and a plurality of electronic components mounted on the module substrate, and a heat dissipation chamber assembly provided in at least a portion of the first case, and including a heat diffusion chamber in thermal contact with at least one of the electronic components and a sidewall structure extending vertically toward the module substrate to surround the electronic component in thermal contact with the heat diffusion chamber.