SSD Encapsulating Colloid Isolating Circuit from Air
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Solution Overview
Problem
In traditional SSD encapsulation methods, circuit components are exposed to air, leading to dampness, dust contamination, and unstable functionality due to lack of protection.
Innovation Solution
A Solid-State Drive (SSD) storage module with an encapsulating colloid that seamlessly covers the electronic circuit on a printed circuit board, featuring metal contact pieces for electrical connections, including SATA interface contact pieces, and a separation slot for component arrangement, which isolates the circuit from air, ensuring stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If circuit components are directly welded on a circuit board without encapsulation, then the manufacturing process is simple and cost-effective, but the circuit components are exposed to air, leading to dampness, dust contamination, and unstable functionality
Solution Approach 1:
The patent applies an encapsulating colloid layer that forms a protective film over the circuit board and components. This thin film encapsulation method provides environmental protection while maintaining manufacturing simplicity, as the colloid can be applied through coating processes rather than complex assembly steps.
Solution Approach 2:
The encapsulating colloid creates an isolated environment for the circuit components, effectively replacing direct exposure to harmful atmospheric elements. The colloid material itself acts as an inert barrier that prevents moisture and dust from reaching the circuit board, thereby improving reliability without complicating manufacturing.
2Shape
If an outer shell is assembled around the circuit board, then the SSD has a complete enclosure, but extra space remains causing circuit components to be directly exposed in the air, leading to dampness and dust contamination
Solution Approach 1:
Instead of leaving gaps in the outer shell enclosure, the patent applies an encapsulating colloid layer that fills the remaining space and provides continuous protective coverage. This thin film approach ensures complete environmental isolation of the circuit components while maintaining the overall enclosure structure.
Solution Approach 2:
The encapsulating colloid layer is nested within the outer shell enclosure, creating a dual-layer protection system. The colloid forms an inner protective layer that fills gaps and provides direct contact protection to circuit components, while the outer shell provides structural enclosure, together eliminating all air exposure pathways.
3Temperature
If circuit components are exposed to air, then heat dissipation is improved, but the components are prone to be dampened and contaminated by dust, affecting performance and stability
Solution Approach 1:
The encapsulating colloid layer acts as a thermal interface that maintains heat dissipation pathways while providing environmental protection. The material allows thermal energy to pass through while blocking moisture and dust, enabling the circuit components to remain thermally managed without direct air exposure.
Solution Approach 2:
The encapsulating colloid represents a composite material solution that combines protective properties with thermal conductivity. This material enables simultaneous achievement of environmental isolation and thermal management, allowing heat dissipation while preventing dampness and dust contamination that would otherwise degrade component stability.
Data Source
AI summary
A SSD storage module comprising a printed circuit board (1), an encapsulating colloid (2), and an electronic circuit (3) welded on an inner surface of the printed circuit board (1) and having a data storage function; the encapsulating colloid (2) is formed on the inner surface of the printed circuit board (1) and is configured for seamlessly encapsulating the electronic circuit (3), an outer surface of the printed circuit board (1) is provided with a plurality of metal contact pieces (11), the plurality of metal contact pieces (11) are electrically connected with the electronic circuit (3), and the plurality of metal contact pieces (11) comprise a plurality of SATA interface contact pieces (110). The encapsulating colloid (2) seamlessly encapsulates the electronic circuit (3) and isolates the electronic circuit (3) from the air, such that a problem that the electronic circuit (3) is directly exposed to the air, and performances of components of the electronic circuit (3) may be affected, thereby resulting in an unstable functionality of a SSD can be avoided.