Embedded SSD Controller Thermal Path Layout for Dual-Sided Cooling
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Solution Overview
Problem
The increasing heat generation in SSD control elements due to higher memory capacity and faster operation speeds leads to reduced programming and reading speeds, necessitating effective heat dissipation solutions.
Innovation Solution
A memory device design featuring a wiring substrate with a multilevel wiring layer, a control element embedded within, and a dual heat dissipation structure comprising a first heat dissipation member and a heat dissipation conductor pattern that forms a heat dissipation path between the control element and the heat dissipation member, allowing for efficient heat dissipation from both surfaces of the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the control element operates at higher speed and higher memory capacity, then the performance of the control element is improved, but the heat generation increases causing memory element temperature to rise
Solution Approach 1:
The heat dissipation function is segmented into two independent paths: one through the first heat dissipation member contacting the first element surface, and another through the heat dissipation structure contacting the second element surface. This segmentation allows heat to be dissipated through multiple separate channels, improving overall heat dissipation efficiency while maintaining high operation speeds.
Solution Approach 2:
The invention transitions from single-sided heat dissipation to dual-sided heat dissipation by utilizing both the first element surface and the second element surface of the control element. The heat dissipation structure extends to the second surface of the wiring substrate, creating a three-dimensional heat dissipation pathway that effectively reduces temperature rise while maintaining high operation speeds.
2Temperature
If the memory element temperature increases, then the heat dissipation requirement increases, but the programming speed and reading speed must be reduced
Solution Approach 1:
The multilevel wiring layer serves as a thermal intermediary, containing heat dissipation conductor patterns that form dedicated heat dissipation paths between the control element and the first heat dissipation member. This intermediary structure efficiently transfers heat away from the control element, preventing temperature rise that would otherwise force reduction in programming and reading speeds.
Solution Approach 2:
The multilevel wiring layer performs dual functions: electrical connection between components and thermal conduction for heat dissipation. The heat dissipation conductor patterns within the wiring layer simultaneously serve as electrical conductors and thermal pathways, enabling efficient heat removal while maintaining signal integrity, thus preserving high programming and reading speeds.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses the increase in temperature of the memory element, maintaining optimal operation speeds by efficiently dissipating heat from the control element, thereby preventing reductions in programming and reading speeds even at elevated temperatures.
Implementation Method 1
a heat dissipation conductor pattern forming a heat dissipation path between the control element and the first heat dissipation member
Implementation Method 2
a first heat dissipation member located at a region of the first surface of the wiring substrate overlapping the control element
Data Source
AI summary
A memory device includes: a wiring substrate including a multilevel wiring layer and first and second surfaces at opposite sides; a control element embedded in the wiring substrate and having first and second element surfaces at opposite sides, with multiple electrode pads connected to the multilevel wiring layer at the first element surface; a first heat dissipation member at a region of the first surface overlapping the control element; a heat dissipation structure facing the second element surface and exposed at the second surface; and at least one memory element connected with the multilevel wiring layer at a first surface region not overlapping the control element. The multilevel wiring layer includes a signal pattern electrically connecting the control element with the memory element or the external connection terminal, and a heat dissipation conductor pattern forming a heat dissipation path between the control element and the first heat dissipation member.