SSD Dummy Package Heat Path for PCB Thermal Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing demand for compact and multi-functional electronic devices necessitates improved semiconductor packages that can effectively dissipate heat generated by multiple semiconductor chips, as existing technologies face challenges in managing thermal dissipation efficiently.
Innovation Solution
A semiconductor package design that incorporates a dummy package electrically coupled with the printed circuit board, providing a heat path for heat dissipation, utilizing a metal layer with high thermal conductivity and a polished layer to minimize interfacial resistance, and an adhesive layer with high thermal conductivity to facilitate heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor chips are integrated into a compact package, then device functionality and capacity are improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent segments the package structure into functional regions (memory region with memory packages and driving region with driving packages) and introduces a dummy package specifically dedicated to heat dissipation functions. This segmentation allows the heat dissipation pathway to be separated from the functional components, enabling effective thermal management while maintaining high device functionality.
Solution Approach 2:
The dummy package acts as an intermediary thermal management component between the heat-generating semiconductor chips and the heat sink. It includes a first pad on the printed circuit board, a metal layer in the dummy package, and a second pad on the heat sink, creating a dedicated heat transfer pathway that mediates thermal energy flow without interfering with the electrical functions of the memory and driving packages.
2Temperature
If heat dissipation pathways are added to manage thermal load, then temperature control is improved, but device complexity increases
Solution Approach 1:
The dummy package is designed with multi-functionality, serving both as a structural placeholder in the package layout and as a dedicated heat dissipation pathway. The metal layer within the dummy package simultaneously provides mechanical support and thermal conduction, while the first and second pads integrate the dummy package into both the electrical and thermal networks of the system.
Solution Approach 2:
The patent utilizes parameter changes in material selection, specifically employing high thermal conductivity materials for the metal layer and adhesive layers in the dummy package. By optimizing the thermal conductivity parameter of these materials, the heat dissipation efficiency is significantly improved without requiring complex active cooling mechanisms or additional structural components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation efficiency, preventing excessive temperature increases in memory and driving chips, thereby maintaining their performance and extending their lifespan by providing an additional heat path for thermal management.
Implementation Method 1
a metal layer electrically coupled with the first pad... providing a heat path for heat dissipation
Implementation Method 2
an adhesive layer with high thermal conductivity to facilitate heat transfer
Data Source
AI summary
The present disclosure provides semiconductor packages including dummy packages. In some embodiments, the semiconductor package includes a solid-state drive (SSD) device including a printed circuit board including a memory region, a plurality of memory packages disposed on the memory region, and at least one dummy package disposed on the memory region. The at least one dummy package is electrically coupled with the printed circuit board. The at least one dummy package includes a first pad constituting a heat path through which heat of the printed circuit board is dissipated.