SSD Chip Shielding Structure With Elastic EMI-ESD Contact
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Solution Overview
Problem
Electronic devices face challenges in protecting electronic components from electromagnetic interference (EMI) and electrostatic discharge (ESD) as they are miniaturized and require effective shielding solutions.
Innovation Solution
A solid state drive (SSD) apparatus with a shielding structure that includes elastic unit shielding structures surrounding semiconductor chips, electrically connected to the case, providing a restoring force to maintain contact and improve shielding performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a shielding structure is used to protect semiconductor chips from EMI and ESD, then shielding performance is improved, but device complexity increases
Solution Approach 1:
The shielding structure is divided into multiple unit shielding structures (first unit shielding structures and second unit shielding structures) that are spaced apart to form gaps. Each unit shielding structure independently surrounds and protects semiconductor chips, allowing the shielding function to be distributed across multiple simpler components rather than requiring a single complex continuous shield.
Solution Approach 2:
The unit shielding structures incorporate elastic bodies that can deform and restore, providing flexible contact with the case and substrate. This flexibility allows the shielding structure to adapt to manufacturing tolerances and assembly variations without requiring precise rigid positioning, thereby reducing overall structural complexity while maintaining effective shielding.
2Temperature
If unit shielding structures are spaced apart with gaps, then heat dissipation is improved, but shielding effectiveness may deteriorate
Solution Approach 1:
The continuous shielding structure is segmented into multiple unit shielding structures with gaps between them. These gaps create channels for air flow and heat dissipation while the segmented structures maintain electromagnetic shielding through their distributed arrangement and connection to ground pads.
Solution Approach 2:
The shielding structure incorporates gaps between unit shielding structures that function similarly to porous materials, allowing thermal convection and air flow for heat dissipation while maintaining electromagnetic shielding properties through the distributed conductive elements and their connection to ground.
3Manufacturing precision
If the shielding structure is rigid, then manufacturing precision is improved, but adaptability to deformation deteriorates
Solution Approach 1:
The unit shielding structures incorporate elastic bodies that can deform and restore, providing flexible contact with the case and substrate. This flexibility allows the shielding structure to adapt to manufacturing tolerances and assembly variations without requiring precise rigid positioning, thereby reducing overall structural complexity while maintaining effective shielding.
Solution Approach 2:
The shielding structure transitions from a static rigid design to a dynamic flexible design where the elastic bodies can deform to accommodate variations in assembly and operation, maintaining reliable electrical contact and shielding performance across different conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the reliability of EMI and ESD shielding by maintaining structural integrity and contact with the case, even with deformation, thereby improving the overall reliability of the SSD apparatus.
Implementation Method 1
an elastic body configured to provide a restoring force to the conductor
Data Source
AI summary
A solid state drive apparatus includes a case including an upper wall and a lower wall, a substrate in the case and including a plurality of first connection pads in or on a first surface of the substrate facing the upper wall of the case, a first semiconductor chip on the first surface of the substrate, and a first shielding structure electrically connecting the upper wall of the case to the plurality of first connection pads, wherein the first shielding structure includes a plurality of first unit shielding structures surrounding the first semiconductor chip and spaced apart from each other with gaps therebetween, and wherein each of the plurality of first unit shielding structures includes an elastic body.