SSD Enclosure with Articulating Joint and Heat Exchanger

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional distributed storage systems require significant financial investment and cooling infrastructure, making them less efficient and cost-competitive for high-speed data access in enterprise and industrial applications, particularly with the advent of modern SSD technology.

Innovation Solution

An enclosure apparatus for SSDs featuring a rigid case with thermal conductivity properties, a heat exchanger coil, and an articulable joint for secure and efficient heat dissipation, along with a method for SSD cloning using dual SSD interfaces and a PCIe switch for high-speed data transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If conventional distributed storage systems with hard disk drives are used, then data storage capacity is achieved, but significant financial investment and cooling infrastructure are required

Engineering Contradiction:
Improvedata storage capacityVSAvoidcooling infrastructure
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

The patent transitions from mechanical hard disk drives to solid-state drives, fundamentally changing the storage medium parameter. This parameter change eliminates moving parts and significantly reduces heat generation, thereby eliminating the need for complex cooling infrastructure while maintaining data storage capacity

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent replaces the mechanical hard disk drive system with a solid-state drive system that has no moving parts. This substitution eliminates the mechanical components that generate heat and require cooling, thereby resolving the contradiction between storage capacity and cooling infrastructure complexity

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Volume of moving object

If SSDs are used in portable electronic devices, then cost and miniaturization improvements are achieved, but improvements in usage and integration are needed

Engineering Contradiction:
Improvedevice sizeVSAvoidusage and integration
Core Design Contradiction:
Volume of moving objectVSEase of operation

Solution Approach 1:

The patent designs an enclosure that can accommodate different SSD form factors and configurations, making the device universally applicable. The articulating cover mechanism provides multiple access configurations that facilitate ease of operation during installation, maintenance, and data retrieval, thereby resolving the contradiction between miniaturization and ease of usage

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Speed

If SSDs operate at high speed, then data access performance is improved, but heat generation increases requiring thermal management

Engineering Contradiction:
Improvedata access speedVSAvoidheat generation
Core Design Contradiction:
SpeedVSTemperature

Solution Approach 1:

The patent introduces a thermally conductive intermediary material between the SSD and the enclosure housing. This intermediary acts as a heat transfer medium, conducting heat away from the high-speed SSD to the enclosure structure, thereby enabling high data access speeds while managing heat generation through thermal conduction

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The enclosure effectively manages heat dissipation and reduces operational costs by using thermally conductive materials and a heat exchanger, while the SSD cloning method achieves high data transfer rates exceeding 2800 megabytes per second, enhancing data integrity and storage capacity.

Implementation Method 1

mounting the enclosure's first surface near the SSD establishes a path of thermal conductivity through which the SSD first conducts heat from the SSD to the coil, and then conducts the heat from the coil to the body

Methodology Applied
Scientific EffectThermal conductivity: Conduction (thermal)

Implementation Method 2

A heat exchanger body having a first surface and an opposing second surface. A heat exchanger coil is at least partially embedded in the body

Methodology Applied
Scientific EffectHeat exchange: Heat Exchanger

Data Source

PatentUS11520381B2Enclosing a portable solid state device
Publication Date: 2022.12.06 NEXARK INC
  • US11520381B2 patent drawing
  • US11520381B2 patent drawing
  • US11520381B2 patent drawing

AI summary

Apparatus and associated methodology contemplating an enclosure apparatus for a solid-state device (SSD). The apparatus includes a rigid case having a wall defining an internal cavity. A surface in the wall defines one of a recess or a protuberant tab exposed to the internal cavity. A cover is configured to connect with the case in a closed position in which the cover and the case are connected together to cooperatively enclose the internal cavity. The cover defines the other of the recess or the tab, the tab sized to be removably insertable into the recess to form an articulable joint connecting the cover and the case together in the closed position.