SSD Label Component Thermal Management
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Solution Overview
Problem
Conventional labels on solid-state drives (SSDs) have low heat conductivity, which limits their ability to effectively dissipate heat generated by electronic components, leading to inefficient heat management and potential thermal issues.
Innovation Solution
A label component with alternating high heat conductive and low heat conductive materials is used, where high heat conductive members are strategically positioned to dissipate heat from semiconductor devices, and low heat conductive members are placed between them to prevent unwanted heat transfer, allowing for controlled heat dissipation and management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional label material (plastic or resin) is used, then the label can be easily manufactured and attached, but the heat dissipation performance is poor due to low heat conductivity
Solution Approach 1:
The label component uses a composite structure combining a resin base material with embedded high-heat-conductivity filler particles. This composite approach maintains the ease of manufacturing conventional labels while significantly improving heat dissipation performance through the thermal conductive filler network.
Solution Approach 2:
The patent modifies the thermal conductivity parameter of the label material by incorporating filler particles with higher heat conductivity than the base resin. This parameter change enables the label to dissipate heat effectively while maintaining its conventional label functionality and manufacturability.
2Temperature
If high heat conductive materials are used to improve heat dissipation, then heat dissipation performance improves, but heat transfer to adjacent components may increase causing thermal interference
Solution Approach 1:
The label component features non-uniform distribution of heat conductive filler particles, creating regions with different thermal conductivity. Areas near heat-generating components have higher conductivity for efficient heat dissipation, while areas near sensitive components have lower conductivity to prevent thermal interference.
Solution Approach 2:
The label acts as a thermal intermediary with spatially varying conductivity properties. It mediates heat transfer from high-temperature components to the surrounding environment while protecting adjacent low-temperature-sensitive components from excessive heat through localized thermal resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation performance by directing heat away from sensitive components, maintaining optimal operating temperatures and preventing thermal interference between different semiconductor devices.
Implementation Method 1
a label component with alternating high heat conductive and low heat conductive materials is used, where high heat conductive members are strategically positioned to dissipate heat from semiconductor devices
Data Source
AI summary
According to one embodiment, a memory system includes a substrate, a first semiconductor device, a second semiconductor device, and a label. The first semiconductor device is on a first surface side of the substrate. The second semiconductor device is also on the first surface side of the substrate. The label has a first thermal conductive portion proximate to the first semiconductor device, a second thermal conductive portion proximate to the second semiconductor device, and an insulating portion that is between the first and second thermal conductive portions.