SSD Lid Assembly Cooling Using Thermoelectric Heat Harvesting
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Solution Overview
Problem
Overheating in solid-state drives (SSDs) leads to increased electron energy, causing charge leakage and bit errors, compromising data retention and endurance.
Innovation Solution
Incorporation of thermoelectric (TE) elements between IC chips and a lid assembly, with an electronic controller using generated voltages to power a fan for airflow, maintaining the lid assembly at ambient temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermoelectric elements are added to harvest heat and power a fan, then heat removal capability is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple functions into the lid assembly: it serves as both a structural cover and an active heat dissipation component with integrated fan and thermoelectric elements. The controller is also integrated into the lid assembly, merging control functions with the thermal management system. This consolidation improves heat removal while minimizing the increase in overall device complexity.
Solution Approach 2:
The lid assembly is designed as a multi-functional component that simultaneously provides structural protection, active cooling through the fan, and heat harvesting through thermoelectric elements. The same lid structure houses both the fan for active cooling and the thermoelectric elements for energy harvesting, making the system more efficient without requiring separate dedicated components for each function.
2Temperature
If multiple TE elements and fan are integrated into the lid assembly, then heat dissipation is improved, but manufacturing complexity increases
Solution Approach 1:
The thermal management system is segmented into modular components: multiple individual thermoelectric elements are distributed across the lid assembly, each connected to specific heat-generating IC chips. The fan is mounted on the lid assembly as a separate module. This segmentation allows for easier manufacturing and assembly, as components can be produced independently and then integrated.
Solution Approach 2:
The lid assembly itself acts as an intermediary structure that facilitates the integration of thermoelectric elements and fan. By mounting these components on the lid rather than directly on the IC chips or circuit board, the patent simplifies manufacturing and assembly processes while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes heat from IC chips, reducing electron leakage and bit errors, thereby enhancing data retention and endurance in SSDs.
Implementation Method 1
receive a plurality of voltages generated by the plurality of TE elements in response to the heat generated in the IC chips
Implementation Method 2
The electrical fan generates an airflow for keeping the lid assembly at approximately ambient temperature, thereby facilitating heat removal from the IC chips
Data Source
AI summary
A data storage device includes TE elements thermally connected between IC chips thereof and a lid assembly. An electronic controller of the data storage device is configured to receive voltages generated by the TE elements in response to the heat generated in the IC chips and is further configured to use the voltages to provide electrical power to an electrical fan of the lid assembly. The fan generates an airflow for keeping the lid assembly at approximately ambient temperature, thereby facilitating heat removal from the IC chips by way of the TE elements.