SSD Module Housing With Stacked Metal Layers for Heat Dissipation
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Solution Overview
Problem
Conventional SSD modules housed in a housing do not effectively dissipate heat generated by electronic components, leading to inefficiencies in heat dissipation and potential temperature-related performance degradation.
Innovation Solution
The module incorporates a housing with first and second metal layers stacked on inner surfaces, forming a stacked part in regions outside the contact surfaces of semiconductor devices, enhancing heat dissipation without increasing module thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional heat dissipation methods using heat dissipating rubber are used, then the structure is simple and easy to manufacture, but heat dissipation efficiency is insufficient for housed mounting boards
Solution Approach 1:
The patent transitions from conventional point-contact heat dissipation to a planar stacked metal layer structure. The first metal layer contacts the semiconductor device surface, while the second metal layer is stacked on the housing inner surface, creating a two-dimensional heat dissipation pathway that significantly increases the heat transfer area and efficiency.
Solution Approach 2:
The patent employs a composite heat dissipation structure combining two different metal layers with potentially different thermal conductivities. The first metal layer directly contacts the semiconductor device, while the second metal layer contacts the housing, creating a composite thermal pathway that optimizes heat transfer from the heat source to the external environment.
2Temperature
If stacked metal layers are added to improve heat dissipation, then heat dissipation efficiency improves, but device complexity increases
Solution Approach 1:
The stacked metal layer structure serves multiple functions simultaneously: it acts as a heat dissipation pathway, provides mechanical support for the mounting board, and can serve as an electromagnetic shielding layer. This multi-functionality reduces the need for separate components, thereby limiting the increase in overall device complexity.
Solution Approach 2:
The patent merges the heat dissipation function with the existing housing structure by stacking the metal layers directly on the housing inner surface. This integration approach combines multiple functions into a single structural element, avoiding the need for separate heat dissipation components and minimizing complexity increase.
3Temperature
If heat dissipation structures are added, then heat dissipation efficiency improves, but module thickness increases
Solution Approach 1:
The patent resolves the thickness constraint by changing the heat dissipation approach from a vertical extension (adding thickness) to a planar configuration (using stacked layers on the housing surface). The heat dissipation occurs laterally through the stacked metal layers rather than extending the module thickness, thus improving heat dissipation without increasing the overall module length.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation efficiency, preventing temperature rise and maintaining data transfer rates by effectively dissipating heat generated by semiconductor chips.
Implementation Method 1
The first metal layer formed on at least a part of an inner surface of at least one of the first face part and the second face part of the housing and a surface on a housing side of the semiconductor device are in direct or indirect contact; and a stacked part in which the first metal layer and the second metal layer are stacked
Data Source
AI summary
Provide a module that can improve heat dissipation efficiency. The module has a housing and an electronic component mounting board that is housed in the housing and has a semiconductor device and a board on which the semiconductor device is mounted. In the module, a first metal layer formed on an inner surface of a first face part of the housing and the housing side surface of the semiconductor device are in contact. In the module, a stacked part in which the first metal layer and a second metal layer are stacked is formed on at least a part of a second region between an outer edge of a first region including the contact surface between the first metal layer and the housing side surface of the semiconductor device and an outer edge of an inner surface of the housing.