SSD Module Thermal Layout for Isolated Chip Heat Paths
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Solution Overview
Problem
Modules including electronic components generate heat during operation, which can cause damage and affect performance and service life, necessitating improved heat dissipation methods.
Innovation Solution
A module design with separate thermal conductive elements for different chips, each with distinct critical operation temperatures, and a thermal conductive layer to manage heat dissipation without direct thermal coupling between elements, combined with thermal insulation to prevent heat transfer and temperature-based speed regulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate thermal conductive elements are used for different chips with different critical operation temperatures, then heat dissipation effectiveness is improved, but device complexity increases
Solution Approach 1:
The patent divides the thermal management system into separate thermal conductive elements for different chips. Each chip (control unit and storage unit) has its own dedicated thermal conductive element that conducts heat to the substrate, preventing thermal interference between components with different thermal requirements.
Solution Approach 2:
The substrate serves as an intermediary thermal management layer between the thermal conductive elements and the external environment. The substrate's thermal conductivity is specifically optimized to facilitate heat dissipation from multiple sources while maintaining appropriate thermal isolation between different chip components.
2Measurement precision
If direct thermal coupling between thermal conductive elements is prevented, then temperature control precision is improved, but heat conduction efficiency deteriorates
Solution Approach 1:
The patent segments the thermal conduction paths by providing separate thermal conductive elements for the control unit and storage unit. This segmentation prevents direct thermal coupling between these components, allowing independent temperature control for each chip type based on their different critical operation temperatures.
Solution Approach 2:
The substrate performs multiple thermal management functions simultaneously: it serves as a mechanical support structure, an electrical connection medium, and a thermal conduction pathway. Its optimized thermal conductivity enables it to efficiently dissipate heat from multiple separate thermal conductive elements without requiring direct coupling between them.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively dissipates heat, prevents overheating, and maintains module performance by ensuring different chips have distinct heat conduction paths and temperature management, reducing the risk of damage and improving operational efficiency.
Implementation Method 1
a first thermal conductive element on the control unit
Implementation Method 2
a second thermal conductive element on the first storage unit
Implementation Method 3
There is no direct thermal coupling between the first thermal conductive element and the second thermal conductive element
Data Source
AI summary
A module including a solid-state drive is provided. The module includes a substrate having an upper surface, a control unit on the upper surface of the substrate and having a first critical operation temperature, a first storage unit on the upper surface of the substrate and having a second critical operation temperature, a first thermal conductive element on the control unit, wherein the control unit is between the first thermal conductive element and the substrate, and a second thermal conductive element on the first storage unit, wherein the first storage unit is between the second thermal conductive element and the substrate. The first critical operation temperature is greater than the second critical operation temperature. There is no direct thermal coupling between the first thermal conductive element and the second thermal conductive element.