Solid State Drive Packages Using Package-on-Package Stacking
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Solution Overview
Problem
Current solid state drive (SSD) packaging technologies face challenges in achieving optimal thermal management, reliability, and compact form factor, which are essential for next-generation storage devices.
Innovation Solution
The implementation of a package-on-package (PoP) technique connecting a controller package with at least one non-volatile memory package, utilizing a heat sink and thermal barriers to prevent heat transfer, and incorporating a dynamic random access memory (DRAM) auxiliary memory unit for efficient data handling, while adhering to standards like SATA for communication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a package-on-package (PoP) technique is used to connect controller package and non-volatile memory package, then the footprint of SSD is reduced, but thermal management becomes more challenging due to stacked configuration
Solution Approach 1:
The patent transitions from a planar arrangement to a three-dimensional stacked configuration using package-on-package (PoP) technique. The controller package and non-volatile memory package are vertically stacked and connected via through connection terminals, reducing the horizontal footprint while managing thermal characteristics through the vertical dimension and spacing between packages.
2Volume of moving object
If controller package and non-volatile memory package are closely stacked to reduce size, then compactness is improved, but heat transfer between packages increases
Solution Approach 1:
The patent introduces thermal barriers as intermediary elements positioned between the controller package and non-volatile memory package. These thermal barriers block direct heat transfer pathways while allowing the packages to remain in close stacked configuration, thus maintaining compactness while reducing harmful thermal coupling.
3Area of stationary object
If through connection terminals are used to connect packages vertically, then the footprint is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent implements a nested vertical stacking architecture where the controller package and non-volatile memory package are positioned one above the other and connected through through connection terminals. This nesting approach consolidates multiple functional packages into a single vertical column, reducing footprint while requiring precise alignment during manufacturing.
4Productivity
If auxiliary memory unit is integrated into controller package, then data handling efficiency is improved, but device complexity increases
Solution Approach 1:
The patent merges the auxiliary memory unit with the controller package by disposing the auxiliary memory unit at substantially the same height as the SSD controller chip and connecting both to the non-volatile memory package. This integration improves data handling efficiency by placing buffer memory closer to the controller logic, while the merged structure reduces overall device complexity compared to separate implementations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances thermal characteristics, reliability, and reduces the footprint of SSDs, enabling the creation of compact storage devices with improved performance and efficiency.
Implementation Method 1
The SSD package may further include a heat sink formed on the non-volatile memory package
Implementation Method 2
utilizing a heat sink and thermal barriers to prevent heat transfer
Data Source
AI summary
Solid state drive (SSD) packages are provided including a controller package and at least one non-volatile memory package. The controller package and the at least one non-volatile memory package are connected to each other using a package-on-package (PoP) technique. A data input/output of the at least one non-volatile memory package is controlled by using the controller package.