SSD Package-on-Package Structure for Compact Storage
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Solution Overview
Problem
Current solid state drive (SSD) systems face challenges in achieving higher speeds and miniaturization while maintaining reliability and efficiency, particularly in compact and lightweight designs.
Innovation Solution
The SSD package-on-package (PoP) configuration, which includes a lower package substrate with a controller chip and non-volatile memory chips, along with individual electronic components, is used. This configuration features a stack of non-volatile semiconductor memory chips and individual electronic components electrically connected to the lower package, allowing for increased storage capacity and speed while minimizing physical size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If individual electronic components are mounted directly on the lower package substrate, then electrical connection is achieved, but the overall package height increases
Solution Approach 1:
The patent implements nesting by placing the lower package (containing controller chip and mold layer) inside or beneath the upper package substrate, with individual electronic components mounted on the upper package substrate. This nested arrangement allows electrical connection while maintaining a compact overall package height, as the components are integrated into the upper package structure rather than extending below the lower mold layer.
2Quantity of substance
If multiple non-volatile memory packages are disposed on the lower package, then storage capacity increases, but device complexity increases
Solution Approach 1:
The patent merges multiple non-volatile memory packages onto a single upper package substrate, arranging them in a planar configuration. This combining approach increases storage capacity while managing device complexity by using a unified substrate structure rather than separate packages, simplifying the overall assembly and reducing the number of discrete components.
3Volume of moving object
If the SSD package is miniaturized, then compactness improves, but heat dissipation becomes more difficult
Solution Approach 1:
The patent transitions from vertical stacking to a planar arrangement of memory packages on the upper substrate, spreading heat-generating components across a larger surface area. This dimensional change allows for better heat dissipation through increased surface exposure while maintaining a compact overall package volume, effectively managing thermal issues in miniaturized designs.
Data Source
AI summary
A solid state drive (SSD) package type has a lower package including a lower package substrate, a controller chip mounted on the lower package substrate, and a plurality of upper packages disposed on the lower package as spaced apart from each other. The plurality of upper packages includes at least one non-volatile memory and at least one first individual electronic component. The upper packages are electrically connected to the lower package such that the package type is a package-on-package (PoP) type. The height of the first individual electronic component is greater than the spacing between the lower package and each of the upper packages.