Dual-Sided SSD PCB Signal Swapping for Reliability
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Solution Overview
Problem
Current solid-state drives (SSDs) face challenges in enhancing reliability and operating speed to meet the increasing demands of computer systems, particularly in terms of storage density and power consumption.
Innovation Solution
The SSD design incorporates semiconductor packages mounted on both the top and bottom surfaces of a main printed circuit board (PCB) with specific signal arrangements, including non-swappable and swappable signals, to optimize signal connections and improve data transfer efficiency, while maintaining power signal and ground signal connections to enhance reliability and speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor packages are mounted on both top and bottom surfaces of main PCB with specific signal arrangements, then reliability and operating speed are improved, but device complexity increases
Solution Approach 1:
The patent divides the signal connections into segments: first signals correspond to cells in a reference column, second signals correspond to cells symmetrical to the reference column, and a mode selection signal controls the swapping of second signals. This segmentation allows complex dual-sided mounting to be managed through structured signal groups rather than individual complex routing.
Solution Approach 2:
The patent utilizes the third dimension by mounting semiconductor packages on both the top and bottom surfaces of the main PCB, transitioning from a single-sided (2D) layout to a dual-sided (3D) configuration. This increases storage density while the mode selection signal manages the complexity of interconnections between packages on opposite surfaces.
2Quantity of substance
If semiconductor packages are mounted on both top and bottom surfaces of main PCB, then storage density increases, but manufacturing precision requirements increase
Solution Approach 1:
The ball map is segmented into reference columns and symmetrical columns, with specific signals assigned to each segment. This segmentation provides a standardized pattern that simplifies the manufacturing process for dual-sided mounting, as the same signal arrangement pattern can be replicated on both PCB surfaces.
Solution Approach 2:
The mode selection signal changes the operational parameter of the second signals from non-swapped to swapped configuration. This parameter change allows the same physical package arrangement to support different logical configurations, reducing manufacturing complexity while maintaining high storage density.
3Productivity
If first signals are arranged in a first direction on connection pads, then data transfer efficiency is improved, but circuit interconnection complexity increases
Solution Approach 1:
The patent employs asymmetric signal arrangement where first signals are arranged in a first direction corresponding to cells in a reference column, while second signals correspond to symmetrical cells. This asymmetric yet structured arrangement optimizes data transfer paths while the mode selection signal manages the complexity of symmetrical signal swapping.
Data Source
AI summary
A solid-state drive (SSD) includes a main printed circuit board (PCB), and a first semiconductor package and a second semiconductor package respectively mounted on a top surface and a bottom surface of the main PCB. Each of the first and second semiconductor packages has a surface on which connection pads corresponding to a package ball map are disposed. The package ball map includes cells arranged in a plurality of rows and a plurality of columns, and one signal corresponds to each of the cells of the package ball map. The package ball map includes first signals corresponding to at least some of cells included in a selected reference column from among the plurality of columns, and at least one pair of second signals respectively corresponding to cells that are symmetrical to each other with respect to the reference column. The pair of second signals are swappable signals, and the first signals are not swappable signals.