Removable Test Terminals for SSD In-Situ Testing

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Solution Overview

Problem

Solid State Devices (SSDs) are prone to electrostatic discharge (ESD) due to higher memory densities, which can be exacerbated by their lack of moving parts, and existing testing methods often require disassembly, making them inconvenient for in-situ testing.

Innovation Solution

The implementation of removable test terminals and auxiliary boards with replicated interfaces allows for in-situ testing of SSD components without disassembly, using connectors like pogo pins or via holes to connect with semiconductor package testers, facilitating efficient testing and subsequent removal of the auxiliary boards from the final product.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If removable test terminals and auxiliary boards are added to enable in-situ testing, then testing convenience and reliability are improved, but device complexity increases

Engineering Contradiction:
Improvetesting convenienceVSAvoiddevice complexity
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The testing system is segmented into separate components: the auxiliary board with test terminals is distinct from the main SSD board. This allows the testing function to be added without permanently complicating the SSD structure, as the auxiliary board can be removed after testing.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The auxiliary board acts as an intermediary between the semiconductor package tester and the SSD components. It provides test terminals that connect to the SSD's memory interface, enabling testing without direct disassembly of the SSD itself, thus improving ease of operation while maintaining SSD integrity.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Difficulty of detecting and measuring

If auxiliary boards with test terminals are used for in-situ testing, then component testing capability is improved, but manufacturing steps increase

Engineering Contradiction:
Improvecomponent testing capabilityVSAvoidmanufacturing steps
Core Design Contradiction:
Difficulty of detecting and measuringVSEase of manufacture

Solution Approach 1:

The auxiliary board is prepared in advance with the appropriate test terminals and interface replication before the actual testing begins. This preliminary preparation enables complex testing capabilities to be achieved through a standardized, repeatable process that can be efficiently integrated into manufacturing.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The auxiliary board replicates the memory interface of the SSD using identical or compatible signal pins. This copying of the interface allows the tester to communicate with the SSD components as if they were directly accessible, enabling sophisticated testing without requiring physical disassembly or complex manufacturing modifications.

Inventive Principle:
Principle #26Copying

3Ease of operation

If test terminals are permanently integrated into the SSD, then testing accessibility is improved, but ESD risk and product reliability deteriorate

Engineering Contradiction:
Improvetesting accessibilityVSAvoidESD resistance
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The testing configuration is made dynamic rather than static. The auxiliary board with test terminals is temporarily attached during testing and then removed, transforming the testing accessibility from a permanent feature to a temporary one. This dynamic approach allows easy testing access during the testing phase while eliminating the ESD risk associated with permanent test terminals in the final product.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The test terminals are extracted from the final SSD product. By using a removable auxiliary board that can be taken out after testing, the patent eliminates the ESD vulnerability that would result from permanently integrated test terminals, while still providing testing accessibility during the manufacturing process.

Inventive Principle:
Principle #2Taking out (Extraction)

Data Source

PatentUS8379426B2Solid state device products, intermediate solid state devices, and methods of manufacturing and testing the same
Publication Date: 2013.02.19 SAMSUNG ELECTRONICS CO LTD
  • US8379426B2 patent drawing
  • US8379426B2 patent drawing
  • US8379426B2 patent drawing

AI summary

Example embodiments of the inventive concept are directed to solid state device products, intermediate solid state devices, and methods of manufacturing and testing the same, with removable test terminals, which may permit in situ testing of one or more components of the solid state device products.