SSD Substrate Heater Layer for Cold-Start Temperature Control
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Solution Overview
Problem
Existing methods for heating storage devices in cold environments, such as using flexible printed circuit boards (FPCs) with heater functions, are costly and require additional manufacturing processes, making them inefficient in reducing manufacturing costs and improving workability.
Innovation Solution
A storage device unit with a substrate having multiple wiring layers, including a heat-generating layer with a heat-generating circuit, which is integrated into the substrate to efficiently heat the storage device, eliminating the need for separate FPCs and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate FPC with heater function is prepared and disposed around the storage device, then the storage device can be heated to operate within the guaranteed temperature range, but the manufacturing cost increases and the manufacturing process becomes more complex
Solution Approach 1:
The heater circuit is merged with the substrate wiring layers, eliminating the need for a separate FPC heater. The heat-generating layer is formed as one of the wiring layers on the substrate, integrating the heating function into the existing substrate structure. This reduces manufacturing cost and simplifies the manufacturing process while maintaining the ability to heat the storage device to its guaranteed operation temperature range.
2Reliability
If a separate FPC with heater function is prepared and disposed around the storage device, then the storage device can be heated to operate within the guaranteed temperature range, but the device complexity increases
Solution Approach 1:
The heater circuit is merged with the substrate wiring layers, eliminating the need for a separate FPC heater. The heat-generating layer is formed as one of the wiring layers on the substrate, integrating the heating function into the existing substrate structure. This reduces device complexity by removing the separate FPC component while maintaining the heating capability.
3Reliability
If a separate FPC with heater function is prepared and disposed around the storage device, then the storage device can be heated to operate within the guaranteed temperature range, but the manufacturing process becomes more complex
Solution Approach 1:
The heater circuit is merged with the substrate wiring layers, eliminating the need for a separate FPC heater. The heat-generating layer is formed as one of the wiring layers on the substrate, integrating the heating function into the existing substrate structure. This simplifies the manufacturing process by reducing the number of components and assembly steps, thereby improving productivity and manufacturing workability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces manufacturing costs, improves workability, and ensures the storage device operates within its guaranteed temperature range by efficiently heating the SSD when outdoor temperatures drop, thereby enhancing its performance in cold conditions.
Implementation Method 1
a plurality of wiring layers includes a heat-generating layer having a heat-generating circuit
Data Source
AI summary
The storage device unit includes: a substrate having a main surface and having a plurality of wiring layers stacked together; and a storage device that has a plate shape having a first surface and is disposed on the substrate, the first surface facing the main surface. The plurality of wiring layers includes a heat-generating layer having a heat-generating circuit.