Integrated SSD and Super Capacitor Casing for EMI Shielding

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Solution Overview

Problem

There is a need for a supporting structure that provides both physical and electrical connections between a solid state drive (SSD) module and a super-capacitor to prevent interference from electromagnetic interference (EMI), damage from external shocks, and ensure reliability, especially when the external power supply is cut off.

Innovation Solution

A casing design that includes a first and second case portion with through holes, case mating mediums, and protrusions to establish both physical and electrical connections between the SSD module, super-capacitors, and printed circuit boards, using materials like Fe, Al, Ni, Cu, Au, Ag, Epoxy resin, and SiO2 to ensure secure and conductive connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If separate support structures are provided for SSD module and super-capacitor, then reliability and EMI protection are improved, but device complexity increases

Engineering Contradiction:

ImprovereliabilityVSAvoiddevice complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the SSD module and super-capacitor into a single integrated casing structure. The casing includes a first cavity for the SSD module and a second cavity for the super-capacitor, with through-holes providing both mechanical support and electrical connection. This merging eliminates the need for separate support structures while maintaining reliability and EMI protection.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The through-holes in the casing serve multiple functions simultaneously: they provide mechanical support for the SSD module, establish electrical connections between the super-capacitor and SSD module, and contribute to EMI shielding. This multi-functionality reduces the number of separate components needed.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If through holes are provided for electrical connection, then electrical connectivity is improved, but EMI protection deteriorates

Engineering Contradiction:

Improveelectrical connectionVSAvoidEMI interference

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent employs a conductive casing structure that acts as an EMI shield while incorporating through-holes for electrical connections. The casing material and configuration provide EMI protection by containing electromagnetic fields within the device, while the through-holes are strategically designed to maintain electrical connectivity without compromising the shielding effectiveness.

Inventive Principle:

Principle #30Flexible shells and thin films

3Reliability

If super-capacitor is embedded in casing, then auxiliary power function is improved, but manufacturing complexity increases

Engineering Contradiction:

Improveauxiliary power supplyVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The casing is divided into distinct sections: a first cavity for the SSD module and a second cavity for the super-capacitor. This segmentation allows for modular assembly where the super-capacitor can be independently positioned and connected through the through-holes, simplifying the manufacturing process while maintaining the auxiliary power function.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS8934255B2Super capacitor casing and supercapacitor embedded device

Publication Date: 2015.01.13 SAMSUNG ELECTRONICS CO LTD

AI summary

A casing to support a solid state device SSD therein and super capacitors therein to be electronically connected together.