Integrated SSD and Super Capacitor Casing for EMI Shielding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
There is a need for a supporting structure that provides both physical and electrical connections between a solid state drive (SSD) module and a super-capacitor to prevent interference from electromagnetic interference (EMI) and damage from external shocks, while ensuring reliable operation, especially when the external power supply is cut off.
Innovation Solution
A casing design that includes a first and second case portion with through holes, case mating mediums, and protrusions to establish both physical and electrical connections between the SSD module, super-capacitors, and printed circuit boards, using materials like Fe, Al, Ni, Cu, Au, Ag, Epoxy resin, and SiO2 to ensure secure and conductive connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate support structures are used for SSD module and super-capacitor, then installation flexibility is improved, but device complexity and EMI interference increase
Solution Approach 1:
The patent merges the SSD module and super-capacitor into a single integrated casing structure. The super-capacitor is embedded within the same casing that houses the SSD module, with both components sharing common structural support and connection pathways. This integration eliminates the need for separate support structures while reducing EMI interference through unified shielding and grounding.
2Adaptability or versatility
If separate support structures are used for SSD module and super-capacitor, then installation flexibility is improved, but reliability decreases due to EMI and shock damage
Solution Approach 1:
The integrated casing provides unified EMI shielding and shock protection for both the SSD module and super-capacitor. The common structural framework ensures consistent grounding and reduces electromagnetic interference between components, while the unified design maintains reliability during external shocks.
3Reliability
If through holes are made larger for case mating mediums, then electrical connection reliability is improved, but mechanical strength of case portions decreases
Solution Approach 1:
The case mating mediums feature varying diameters along their length, with larger diameters at the ends for reliable electrical connection and smaller diameters in the middle to fit through the holes. The case portions are reinforced around the through holes with ribs or thicker material to compensate for the holes and maintain mechanical strength while allowing adequate electrical connection area.
Data Source
AI summary
A casing to support a solid state device SSD therein and super capacitors therein to be electronically connected together.


