Thermally Conductive Plate for SSD Heat Dissipation
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Solution Overview
Problem
Solid state drive (SSD) memory devices face challenges in efficiently dissipating heat generated by semiconductor modules, which can lead to reduced performance and reliability due to the lack of effective thermal management solutions.
Innovation Solution
A semiconductor device design that incorporates a thermally conductive plate interposed between the semiconductor module and the case, utilizing thermal interface material to transfer heat from the module to the plate and then to the case for external dissipation, while minimizing the use of expensive thermal interface materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal interface material is used to transfer heat from semiconductor module to case, then heat dissipation capability is improved, but manufacturing cost increases due to expensive thermal interface material
Solution Approach 1:
A thermally conductive plate is introduced as an intermediary component between the semiconductor module and the case. This plate serves as a mediator that facilitates heat transfer from the module to the case, replacing or reducing the need for expensive thermal interface materials while maintaining effective thermal coupling.
Solution Approach 2:
The invention replaces expensive thermal interface materials with a more cost-effective thermally conductive plate structure. The plate provides a durable, reusable thermal management solution that eliminates the need for consumable thermal interface materials, thereby reducing manufacturing costs.
2Ease of manufacture
If thermal interface material is minimized to reduce cost, then manufacturing cost is reduced, but heat dissipation capability deteriorates
Solution Approach 1:
The thermally conductive plate acts as an intermediary that compensates for the reduced amount of thermal interface material. By providing a large surface area and high thermal conductivity path, the plate ensures adequate heat transfer even with minimal thermal interface material usage.
Solution Approach 2:
The solution transitions from relying on a thin layer of thermal interface material (2D contact) to using a three-dimensional thermally conductive plate structure that provides extended thermal pathways, thereby maintaining heat dissipation effectiveness with less interface material.
3Temperature
If semiconductor module is placed closer to heat source for better thermal management, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The case structure is designed to serve multiple functions: it provides mechanical enclosure, structural support, and integrated thermal management through the thermally conductive plate. This multi-functionality reduces the need for separate heat sink components, thereby simplifying the overall device structure while maintaining effective heat dissipation.
Solution Approach 2:
The invention merges the thermal management function with the existing case structure by integrating the thermally conductive plate into the case. This consolidation eliminates the need for separate heat dissipation components and reduces assembly complexity while improving thermal coupling between the semiconductor module and the heat sink.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation capabilities of SSDs, improving performance and reliability while reducing manufacturing costs by allowing for a minimal amount of thermal interface material to be used.
Implementation Method 1
thermal interface material interposed between and thermally coupling the semiconductor module and the plate of the thermal conductor
Implementation Method 2
The thermal conductor is thermally conductively coupled to the bottom part of the case in a region between the plate and the bottom wall of the case. Thus, heat generated by the semiconductor module is transferred to the plate by the thermal interface material and then to the case by the thermal conductor so as to dissipate to the outside of the case.
Data Source
AI summary
A semiconductor device includes a first case part, a second case part coupled to the first case part to provide a case, a semiconductor module disposed within the case closer to the second case part than to the first case part, and a plate interposed between the first case part and the semiconductor module. The plate is a thermal conductor, that is a material having thermal conductivity, to transfer heat generated by the semiconductor module to the case where the heat can dissipate to the outside of the semiconductor device.