SSD Thermal Management via Dual PCB Gap Ventilation
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Solution Overview
Problem
Conventional solid-state drive devices face inadequate heat dissipation, particularly in stacked server configurations where convection through metal housings is insufficient to manage increasing storage and access capacity demands.
Innovation Solution
The design incorporates a housing with first and second circuit boards, ventilation holes, and a gap between them, allowing air flow to remove heat from memory chips through convection, with thermal connection of the controller to the housing for enhanced heat dissipation via conduction and convection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If only metal housing is used for heat dissipation, then the structure is simple, but heat dissipation efficiency is insufficient
Solution Approach 1:
The housing is divided into a first housing portion and a second housing portion with a gap between them, creating separate thermal zones. Memory chips are strategically placed in the gap region to enable direct thermal coupling with both housing portions, segmenting the heat dissipation path into multiple parallel channels that collectively improve thermal management efficiency.
2Adaptability or versatility
If storage capacity and access capacity are increased, then functionality is improved, but heat generation increases making heat dissipation insufficient
Solution Approach 1:
The patent transitions from traditional single-sided heat dissipation to a three-dimensional thermal management architecture. By utilizing the gap between housing portions and positioning memory chips to contact both the first and second housing portions, heat dissipation occurs in multiple spatial dimensions simultaneously, dramatically increasing the effective heat dissipation area and capability.
3Volume of moving object
If devices are stacked in server configuration, then space utilization is improved, but convection heat removal from metal housing becomes insufficient
Solution Approach 1:
The patent extracts the heat dissipation function from the traditional metal housing and creates a dedicated thermal management structure using the gap between housing portions. This extracted thermal pathway operates independently of the external convection environment, enabling effective heat removal even when devices are densely stacked in server configurations where external convection is limited.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves heat dissipation efficiency by utilizing air flow and thermal conduction/convection to effectively manage heat generated by memory chips and the controller, addressing the limitations of conventional metal housing-based heat removal.
Implementation Method 1
The controller is thermally connected to the first member by conduction
Implementation Method 2
Air flow enters the housing and removes the heat from the heat sources (such as memory chips) which are located in the gap. The heat inside the housing is removed by convection
Data Source
AI summary
A solid-state drive device is provided. The solid-state drive device includes a housing, a first circuit board, and a second circuit board. The housing includes a first side and a second side. The first side is opposite to the second side. At least one first ventilation hole is formed on the first side. At least one second ventilation hole is formed on the second side. The first circuit board is disposed in the housing. The second circuit board is disposed in the housing. The second circuit board is coupled to the first circuit board. A gap is formed between the first circuit board and the second circuit board. The first ventilation hole and the second ventilation hole correspond to the gap.