SSD Heat Dissipation Panels With Internal Airflow Channel
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Solution Overview
Problem
The increasing performance of electronic devices leads to excessive heat generation, which can throttle performance and deteriorate reliability, as existing heat dissipation methods are inadequate for managing high power consumption and thermal issues in solid state drive apparatuses.
Innovation Solution
A solid state drive apparatus with a heat dissipation structure that includes a casing with high heat conductivity materials and a heat dissipation structure between substrates, featuring a lower and upper heat dissipation panel with an air passage extending between them, assisted by a cooling fan to enhance convective heat transfer and air flow for efficient heat removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If performance of electronic devices is increased, then processing capability is improved, but heat generation increases
Solution Approach 1:
The patent extracts the heat dissipation function from the housing structure by introducing a separate heat dissipation structure with dedicated heat dissipation panels and air passages. This allows the housing to focus on structural support while the specialized heat dissipation structure handles thermal management, resolving the contradiction between performance improvement and heat generation.
Solution Approach 2:
The heat dissipation panels serve as intermediary elements between the semiconductor chips (heat source) and the external environment. These panels conduct heat from the chips and transfer it to the air flowing through the air passages, effectively mediating the thermal transfer process and preventing excessive heat accumulation that would throttle performance.
2Temperature
If heat dissipation structure is added, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The patent merges the heat dissipation structure with the housing by making the heat dissipation panels integral parts of the housing structure. The first heat dissipation panel is formed as part of the first housing, and the second heat dissipation panel is formed as part of the second housing, combining structural support and heat dissipation functions into unified components rather than separate additions.
Solution Approach 2:
The housing structure serves multiple functions: it provides mechanical support for the semiconductor chips and simultaneously acts as a heat dissipation structure through its integrated heat dissipation panels. This multi-functionality reduces the need for additional dedicated heat dissipation components, thereby limiting the increase in device complexity while improving heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively increases heat dissipation efficiency, maximizing performance utilization and reliability of the solid state drive apparatus by conducting heat through the heat dissipation structure and enhancing convective heat transfer via the air passage and cooling fan.
Implementation Method 1
A heat dissipation structure is disposed between the first substrate and the second substrate and includes a lower heat dissipation panel contacting the at least one first semiconductor chip. An upper heat dissipation panel contacts the at least one semiconductor chip.
Implementation Method 2
A cooling fan is disposed adjacent to the rack and is configured to force an air flow
Data Source
AI summary
A solid state drive apparatus includes a casing including a top plate, a bottom plate, a first sidewall, and a second sidewall. A first substrate is disposed inside the casing. At least one first semiconductor chip is mounted on the first substrate. A second substrate is disposed inside the casing. At least one second semiconductor chip is mounted on the second substrate. A heat dissipation structure is disposed between the first substrate and the second substrate and includes a lower heat dissipation panel contacting the at least one first semiconductor chip. An upper heat dissipation panel contacts the at least one second semiconductor chip. An air passage is provided between the lower heat dissipation panel and the upper heat dissipation panel and extends from the first sidewall of the casing to the second sidewall.