SSD Module Mounting With Thermal Rubber for Heat and Vibration

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Solution Overview

Problem

Electronic apparatuses with SSD modules face challenges in achieving efficient heat dissipation, vibration resistance, and impact resistance, particularly due to the generation of heat during SSD operation and the use of screws which can cause damage to peripheral components.

Innovation Solution

The use of a heat dissipation rubber with high thermal conductivity, which contacts the SSD controller and is thermally connected to the motherboard, combined with an adhesive for attaching the SSD module, eliminating the need for screws to enhance heat dissipation and mechanical resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If screws are used to fix the SSD module to the mother board, then the mechanical strength and fixation reliability are improved, but the risk of damaging peripheral components increases and the vibration resistance deteriorates

Engineering Contradiction:

Improvefixation strengthVSAvoiddamage to peripheral components

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The patent removes the screw fixation mechanism from the system and replaces it with an adhesive bonding system. The SSD module is fixed to the mother board using adhesive applied to the mounting surface, eliminating the need for screws that could damage peripheral components during assembly or vibration.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The mechanical screw fixation system is replaced with a chemical bonding system using adhesive. The adhesive creates a bonding layer between the SSD module mounting surface and the mother board, providing fixation strength without the mechanical intrusion of screws that could damage surrounding components.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Temperature

If traditional heat dissipation methods are used, then the heat dissipation effectiveness is insufficient, but adding more heat dissipation components increases device complexity

Engineering Contradiction:

Improveheat dissipation effectivenessVSAvoidstructure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The mounting structure serves multiple functions: it provides mechanical fixation through adhesive bonding and simultaneously acts as a heat dissipation path. The same adhesive layer and mounting surface that secure the SSD module also conduct heat away from the device, eliminating the need for separate heat dissipation components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The fixation function and heat dissipation function are merged into a single integrated system. The adhesive bonding layer serves dual purposes: providing mechanical strength to hold the SSD module in place and providing thermal conduction to dissipate heat from the device.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If adhesive is used to attach the SSD module, then the vibration resistance and impact resistance are improved, but the heat dissipation effectiveness may worsen compared to direct metal contact

Engineering Contradiction:

Improvevibration resistanceVSAvoidheat dissipation effectiveness

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent uses a composite mounting structure consisting of a rigid support board with specific thermal and mechanical properties. The support board material is selected to provide both adequate adhesive bonding for vibration resistance and sufficient thermal conductivity for heat dissipation, creating a composite solution that balances both requirements.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves heat dissipation, vibration resistance, and impact resistance by effectively dissipating heat generated by SSD components and reducing the risk of damage to peripheral components during assembly and operation.

Implementation Method 1

The elastic member has an inner surface that contacts the second surface or at least one of the electronic components and an outer surface that faces the first surface and is in thermal contact with the metal member

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12199009B2Electronic apparatus

Publication Date: 2025.01.14 KIOXIA CORP

AI summary

An electronic apparatus includes a first substrate, a second substrate, and an elastic member. The first substrate has a first surface on which a metal member is provided. The second substrate is coupled to the first substrate above the first surface and on which a plurality of electronic components is mounted. The second substrate has a second surface that faces away from the first surface. The elastic member has an inner surface that contacts the second surface or at least one of the electronic components and an outer surface that faces the first surface and is in thermal contact with the metal member.