SSD Housing Vent Plate Structure for Heat Dissipation
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Solution Overview
Problem
Conventional solid state drive (SSD) designs face challenges in efficiently dissipating heat and maintaining a compact, aesthetically pleasing form factor while allowing for air flow and easy production at low costs.
Innovation Solution
The SSD design incorporates a first and second casing with a memory module in between, featuring a plate with air holes and wings that form an angle, allowing for air flow and heat dissipation, and using plastic plates for easy production of bent or curved shapes, along with a frame that exposes memory chips for enhanced heat radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional SSD designs use closed-type housing or open-type housing, then structural simplicity is maintained, but heat dissipation efficiency deteriorates
Solution Approach 1:
The housing is divided into a first housing and a second housing that can be separated from each other. The plate with heat dissipation holes is integrated with one of the housings, allowing the heat dissipation structure to be segmented from the main housing body. This segmentation enables effective heat dissipation while maintaining relatively simple individual housing components.
Solution Approach 2:
The plate serves multiple functions: it acts as a structural component of the housing, provides heat dissipation through integrated holes, and may serve as a mounting surface for memory chips. This multi-functionality reduces the need for additional separate heat dissipation components, maintaining structural simplicity while improving heat dissipation efficiency.
2Temperature
If memory chips are enclosed in housing, then aesthetic appearance is improved, but heat radiation capability deteriorates
Solution Approach 1:
The plate incorporates specific regions with heat dissipation holes at locations corresponding to memory chip positions. This local quality approach allows the housing to maintain an enclosed aesthetic appearance overall, while providing targeted heat radiation pathways at specific locations where heat generation occurs. The memory chips remain largely enclosed but have dedicated heat escape routes.
3Temperature
If complex bent or curved shapes are used in plates, then heat dissipation efficiency is improved, but manufacturing cost increases
Solution Approach 1:
The plate is designed with bent or curved shapes that follow the contours of the housing and optimize heat dissipation pathways. These curved geometries improve heat dissipation efficiency by increasing surface area and creating natural convection patterns, while still being manufacturable using standard plastic forming processes.
Solution Approach 2:
The plate is made from plastic material that allows for cost-effective production of complex shapes through injection molding or similar processes. By changing the material parameter to plastic rather than metal, the design achieves both the desired complex curved geometry for heat dissipation and cost-effective mass production capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively dissipates heat, maintains a compact and aesthetically appealing form, and allows for cost-effective mass production by utilizing plastic plates for complex shapes and exposing memory chips for efficient heat radiation.
Implementation Method 1
the plate includes an air hole and a wing
Implementation Method 2
a frame that exposes memory chips for enhanced heat radiation
Data Source
AI summary
A memory device includes: a first casing; a second casing on the first casing; a memory module in an inner space between the first and second casings; and a plate between the first and second casings, wherein the plate includes an air hole and a wing, and wherein the wing includes: a first segment near an outside of the first and second casings; and a second segment near the inner space, wherein the first segment is located at a level different from a level of the second segment.