SSD Thermal Management via Vertical Module Stacking
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Solution Overview
Problem
Solid-state drive devices face challenges in heat dissipation efficiency due to their limited form factor, which restricts the increase in storage capacity and performance, especially in high-performance computer server systems.
Innovation Solution
The design incorporates a heat dissipating member with a plate-shaped portion and a protruding portion that is in direct thermal contact with both modules of the solid-state drive device, enhancing heat dissipation by conduction and convection, and includes a second module interposed between the heat dissipating member and the first module to improve thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of modules is increased to increase storage capacity, then storage capacity is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional stacked configuration. Multiple modules are arranged vertically in layers with heat dissipating members positioned between them, enabling heat dissipation in the vertical dimension while maintaining high storage capacity through increased module quantity.
Solution Approach 2:
Heat dissipating members are introduced as intermediary components positioned between adjacent modules in the stacked configuration. These intermediaries facilitate thermal conduction from the modules to the cooling system, effectively managing heat generation from increased module density without compromising storage capacity.
2Volume of moving object
If the form factor is kept limited to maintain compact size, then device portability is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent utilizes the vertical dimension within the limited form factor by stacking modules and heat dissipating members in layers. This three-dimensional arrangement maximizes heat dissipation surface area without increasing the horizontal footprint, maintaining compact device size while improving thermal management.
Solution Approach 2:
Heat dissipating members are nested between modules in the stacked configuration, with each heat dissipating member positioned within the vertical space occupied by adjacent modules. This nesting approach enables effective heat dissipation infrastructure to be integrated within the compact form factor without requiring additional external space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly enhances heat dissipation efficiency, allowing for increased storage capacity and performance in solid-state drive devices while maintaining a compact form factor, effectively addressing the limitations of existing technologies.
Implementation Method 1
a heat dissipating member having a lower surface and a protrusion protruding from a main part of the lower surface, whereby a distal end of the protrusion and the main part of the lower surface are disposed at a different levels in the solid-state drive device
Implementation Method 2
The plate-shaped portion is vertically juxtaposed with respective portions of the first and second modules and is in direct thermal contact with the third region of the second module
Data Source
AI summary
A solid-state drive device includes a first module including a first region containing a volatile main memory device and a controller device and a second region containing a first nonvolatile memory device, a second module disposed on the first module and having a third region containing a second nonvolatile memory device, the second module being connected to the first module, and a heat dissipating member disposed on the second module as vertically juxtaposed with the first and second modules. The heat dissipating member has a protruding portion protruding toward the first module and in direct thermal contact with the first region, and a plate-shaped portion having a main surface in direct thermal contact with the third region.