SSL Lighting Apparatus Using Bent Conductive Dielectric Stacks

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Solution Overview

Problem

The high cost and environmental hazards associated with the print-and-etch processes used in creating wiring patterns for solid-state lighting (SSL) elements on flexible substrates like polyamides, polyimides, or polyester, make these arrangements expensive and unsustainable for some applications.

Innovation Solution

The use of a stack of electrically conductive and dielectric sheets, which are bent to form a three-dimensional shape, providing even current distribution and heat dissipation for SSL elements, while eliminating the need for hazardous chemicals by employing two-dimensional sheets instead of traditional printing and etching methods.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If print-and-etch processes are used to create wiring patterns on flexible substrates, then wiring patterns can be formed on the substrate, but the manufacturing cost increases and hazardous waste is generated

Engineering Contradiction:
Improvewiring pattern formationVSAvoidhazardous waste
Core Design Contradiction:
Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

The patent extracts and eliminates the hazardous chemical processes from the manufacturing workflow. Instead of using print-and-etch processes that generate hazardous waste, the invention uses pre-formed conductive traces on rigid substrates, completely removing the need for chemical etching and printing processes that produce harmful byproducts.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent employs inexpensive, readily available rigid substrates with pre-formed conductive traces that can be mass-produced through economical means. These substrates serve as disposable or single-use components that eliminate the need for expensive, environmentally hazardous manufacturing processes while maintaining functional requirements.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

2Ease of manufacture

If print-and-etch processes are used to create wiring patterns on flexible substrates, then wiring patterns can be formed on the substrate, but the manufacturing cost increases

Engineering Contradiction:
Improvewiring pattern formationVSAvoidmanufacturing cost
Core Design Contradiction:
Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

The patent removes the expensive print-and-etch manufacturing steps from the process chain. By using pre-formed conductive traces on rigid substrates, the invention eliminates the need for costly chemical processing, specialized equipment, and waste management infrastructure associated with traditional flexible substrate wiring formation.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention utilizes inexpensive rigid substrates with pre-formed conductive patterns that can be manufactured through economical, high-volume production methods. These substrates replace expensive flexible substrates that require costly processing, thereby reducing overall manufacturing costs while achieving the desired electrical connectivity.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

3Ease of manufacture

If traditional printing and etching methods are used, then wiring patterns can be created, but hazardous chemicals are required

Engineering Contradiction:
Improvewiring pattern creationVSAvoidhazardous chemicals
Core Design Contradiction:
Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent completely extracts and eliminates hazardous chemicals from the manufacturing process. Instead of using chemical printing and etching methods that require dangerous substances, the invention employs mechanical or physical methods to achieve conductive trace formation, thereby removing the source of chemical hazards entirely.

Inventive Principle:
Principle #2Taking out (Extraction)

4Adaptability or versatility

If the stack of sheets is bent to form a three-dimensional shape, then the lighting apparatus can be adapted for various applications and shapes, but the structural integrity must be maintained

Engineering Contradiction:
Improvethree-dimensional shape configurationVSAvoidstructural integrity
Core Design Contradiction:
Adaptability or versatilityVSStrength

Solution Approach 1:

The patent employs curved and three-dimensional configurations of rigid substrates that can be bent or folded into various shapes while maintaining structural integrity. The use of rigid substrates with appropriate geometric designs allows the lighting apparatus to achieve spherical, cylindrical, or other curved forms without compromising strength, enabling versatility in application while preserving structural stability.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Data Source

PatentUS10168037B1SSL lighting apparatus
Publication Date: 2019.01.01 AUTOMATED ASSEMBLY
  • US10168037B1 patent drawing
  • US10168037B1 patent drawing
  • US10168037B1 patent drawing

AI summary

A disclosed lighting apparatus includes a first dielectric sheet disposed on the first electrically conductive sheet and a second electrically conductive sheet disposed on the first dielectric sheet. A plurality of solid-state lighting (SSL) elements are electrically coupled to the first electrically conductive sheet and to the second electrically conductive sheet. The first electrically conductive sheet, first dielectric sheet, and second electrically conductive sheet have bends that configure the first electrically conductive sheet, first dielectric sheet, and second electrically conductive sheet in a three-dimensional shape.